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FS32K146UAT0VMHT

NXP Semiconductors

FS32K146UAT0VMHT by NXP Semiconductors

FS32K146UAT0VMHT microcontroller by NXP Semiconductors is a 32-bit RISC-based device with a max clock frequency of 40 MHz. It features 131072 bytes of RAM, 1048576 ROM words, and offers connectivity options such as CAN, I2C, LIN, LPUART, and SPI. This microcontroller is commonly used in applications requiring low power consumption and high-performance computing.

Median Price

$24.025

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 250 parts In-Stock

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$6.480

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$6.480

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Element14

Singapore . 250 parts In-Stock

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$16.130

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$12.810

250

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$16.130

$12.810

DigiKey

USA . 29 parts In-Stock

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$31.920

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$31.920

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Flip Electronics (Authorized)

USA . 29 parts In-Stock

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Verical

USA . 29 parts In-Stock

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$36.862

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Distributors (In-Stock)

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Nova Conductors

Japan . 23 parts In-Stock

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$18.731

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$18.731

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Vyrian

USA . 4,981 parts In-Stock

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Digiode

USA . 3,210 parts In-Stock

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Anansix

USA . 2,451 parts In-Stock

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Flip Electronics

USA . 29 parts In-Stock

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DigiKey Marketplace

USA . 29 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,293 parts In-Stock

1+ parts

$18.731

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$18.357

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$18.731

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$18.357

AZTECH Wire

Italy . 713 parts In-Stock

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$18.781

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$18.781

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Ampacity Inc.

Singapore . 313 parts In-Stock

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$27.130

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313

$27.130

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Microchip USA

USA . 3,613 parts In-Stock

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$46.305

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3,613

$46.305

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Aztec Data Supply Inc.

USA . 663 parts In-Stock

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$49.830

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$49.830

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Corohmni

South Africa . 540 parts In-Stock

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$50.315

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$50.315

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Semicontronic

India . 302 parts In-Stock

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$59.050

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$57.574

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$57.278

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$59.050

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$57.278

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Argo Parts USA

USA . 3,532 parts In-Stock

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Corphita

USA . 1,318 parts In-Stock

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UNI Independent Distributors

Spain . 1,306 parts In-Stock

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Vigor

Singapore . 359 parts In-Stock

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Overview

Experience unrivaled performance and reliability with the FS32K146UAT0VMHT microcontroller by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers cutting-edge solutions that power a wide range of applications. With its advanced features and state-of-the-art technology, this microcontroller offers unmatched value and benefits to customers. Whether you're working on automotive systems, industrial automation, or consumer electronics, the FS32K146UAT0VMHT provides seamless connectivity, exceptional power efficiency, and extensive peripheral options. Trust NXP Semiconductors to elevate your designs and take your projects to new heights. Experience excellence today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the microcontroller from external damage.

Integrated Cache: YES

Having an integrated cache improves the processing speed of the microcontroller.

Maximum Supply Voltage: 5.5 V

The high supply voltage allows for flexibility in power requirements for different applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data accurately.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient and quick execution of instructions, enhancing overall performance.

Technical Specifications

Microcontrollers FS32K146UAT0VMHT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e2

Length:

11 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

89

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

50

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,39

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.41 mm

Speed:

112 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, LIN(3), LPUART(3), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(50), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K146UAT0VMHT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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