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FS32K146HFT0VLQT

NXP Semiconductors

FS32K146HFT0VLQT by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; ROM Programmability: FLASH;

Median Price

$11.430

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 300 parts In-Stock

1+ parts

$11.430

100+ parts

$7.636

1k+ parts

$7.069

10k+ parts

$6.915

300

$11.430

$7.636

$7.069

$6.915

Mouser Electronics

USA . 222 parts In-Stock

1+ parts

$11.760

100+ parts

$8.840

1k+ parts

$6.330

10k+ parts

-

222

$11.760

$8.840

$6.330

-

Verical

USA . 9,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.014

10k+ parts

-

9,900

-

-

$6.014

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,207 parts In-Stock

1+ parts

$13.214

100+ parts

-

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-

10k+ parts

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2,207

$13.214

-

-

-

Chip Stock

USA . 10,400 parts In-Stock

1+ parts

-

100+ parts

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10,400

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Vyrian

USA . 4,129 parts In-Stock

1+ parts

-

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4,129

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Anansix

USA . 2,526 parts In-Stock

1+ parts

-

100+ parts

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2,526

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,444 parts In-Stock

1+ parts

$12.519

100+ parts

-

1k+ parts

-

10k+ parts

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3,444

$12.519

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Vigor

Singapore . 770 parts In-Stock

1+ parts

$13.530

100+ parts

-

1k+ parts

-

10k+ parts

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770

$13.530

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-

-

Native Components

USA . 821 parts In-Stock

1+ parts

$14.024

100+ parts

-

1k+ parts

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10k+ parts

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821

$14.024

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Northwest PG Solutions

USA . 479 parts In-Stock

1+ parts

$15.426

100+ parts

$13.884

1k+ parts

-

10k+ parts

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479

$15.426

$13.884

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Microchip USA

USA . 2,096 parts In-Stock

1+ parts

$46.922

100+ parts

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1k+ parts

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10k+ parts

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2,096

$46.922

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Perfect Parts

USA . 22,400 parts In-Stock

1+ parts

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100+ parts

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22,400

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UNI Independent Distributors

Spain . 7,694 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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7,694

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Technical Specifications

Microcontrollers FS32K146HFT0VLQT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

128

No. of Serial I/Os:

3

No. of Terminals:

144

No. of Timers:

50

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, LIN(3), LPUART(3), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(50), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K146HFT0VLQT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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