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FS32K146HAT0VLLT

NXP Semiconductors

FS32K146HAT0VLLT by NXP Semiconductors

NXP Semiconductors' FS32K146HAT0VLLT microcontroller features a 32-bit CPU, 131072 bytes of RAM, and 1048576 ROM words. With a max clock frequency of 40 MHz, it is ideal for applications requiring CAN, I2C, LIN, LPUART, and SPI connectivity in automotive systems adhering to ISO 26262 standards.

Median Price

$9.032

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 444 parts In-Stock

1+ parts

$11.950

100+ parts

$8.920

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$6.330

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444

$11.950

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$6.330

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Verical

USA . 9,900 parts In-Stock

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$6.114

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9,900

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$6.114

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Distributors (In-Stock)

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Digiode

USA . 4,990 parts In-Stock

1+ parts

$13.319

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4,990

$13.319

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Nova Conductors

Japan . 150 parts In-Stock

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$17.079

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$17.079

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Vyrian

USA . 4,062 parts In-Stock

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4,062

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Anansix

USA . 850 parts In-Stock

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850

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Distributors (Availability)

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Ampacity Inc.

Singapore . 202 parts In-Stock

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$12.290

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Corphita

USA . 1,498 parts In-Stock

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$12.618

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$12.618

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Vigor

Singapore . 602 parts In-Stock

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$13.530

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602

$13.530

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AZTECH Wire

Italy . 831 parts In-Stock

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$19.186

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Microchip USA

USA . 2,428 parts In-Stock

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$46.305

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Lixinc

USA . 6,527 parts In-Stock

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6,527

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UNI Independent Distributors

Spain . 4,736 parts In-Stock

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4,736

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Overview

Elevate your projects to the next level with the FS32K146HAT0VLLT microcontroller by NXP Semiconductors. With a powerful Cortex-M4F CPU family and a wide range of peripherals including BOR, POR, RTC, and more, this microcontroller is designed to deliver top-tier performance for a variety of applications. Whether you're working on automotive systems, industrial automation, or consumer electronics, this product's superior quality and advanced features will help you achieve your goals efficiently and effectively. Experience the value and benefits of NXP Semiconductors' cutting-edge technology with the FS32K146HAT0VLLT microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and cost-effective.

Integrated Cache: YES

Having an integrated cache helps in improving the performance of the microcontroller by reducing access time to frequently used data.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows for flexibility in power supply options and can support a wide range of applications.

On Chip Data RAM Width: 8

With an 8-bit data RAM width, the microcontroller can efficiently process and store data in smaller chunks, enhancing performance.

Screening Level: ISO 26262

Compliance with ISO 26262 ensures that the microcontroller meets the automotive safety standards, making it suitable for use in critical applications.

No. of Terminals: 100

The higher number of terminals provides more connectivity options and flexibility in interfacing with external devices.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, making it suitable for applications that require analog input processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller enhances the processing speed and efficiency of the device, making it a good choice for applications requiring high performance.

No. of Timers: 50

Having 50 timers provides precise timing capabilities, which is essential for applications that require accurate time-keeping and synchronization.

ROM Programmability: FLASH

The use of flash memory for ROM programmability allows for easy and quick reprogramming of the microcontroller, making it versatile and adaptable to different applications.

Technical Specifications

Microcontrollers FS32K146HAT0VLLT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

89

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

50

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

80 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, LIN(3), LPUART(3), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(50), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K146HAT0VLLT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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