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FS32K146HAT0VLLR

NXP Semiconductors

FS32K146HAT0VLLR by NXP Semiconductors

NXP Semiconductors' FS32K146HAT0VLLR microcontroller features a 32-bit CPU, 131072 bytes of RAM, and 1048576 ROM words. Ideal for applications requiring CAN, I2C, LIN, LPUART, and SPI connectivity with low power mode support. Operating temperature ranges from -40 to 105 °C.

Median Price

$9.160

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 993 parts In-Stock

1+ parts

$12.120

100+ parts

$7.810

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$6.240

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993

$12.120

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$6.240

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Verical

USA . 10,000 parts In-Stock

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$6.200

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$6.200

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Distributors (In-Stock)

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Digiode

USA . 3,259 parts In-Stock

1+ parts

$12.578

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Nova Conductors

Japan . 550 parts In-Stock

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$18.741

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$18.741

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Vyrian

USA . 3,717 parts In-Stock

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Anansix

USA . 176 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 899 parts In-Stock

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$11.850

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Corphita

USA . 1,368 parts In-Stock

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$11.916

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Vigor

Singapore . 762 parts In-Stock

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$13.700

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762

$13.700

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Netroflash

USA . 100 parts In-Stock

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$18.741

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$17.804

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$17.429

100

$18.741

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$17.804

$17.429

Microchip USA

USA . 2,176 parts In-Stock

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$46.151

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Component Connect

USA . 62,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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UNI Independent Distributors

Spain . 7,893 parts In-Stock

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Overview

Unlock the power of innovation with the FS32K146HAT0VLLR microcontroller from NXP Semiconductors. This cutting-edge device offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With advanced features like integrated cache, DMA channels, and peripherals like BOR and RTC, this microcontroller provides exceptional value and performance. Trust NXP Semiconductors to deliver top-notch technology that will take your projects to the next level. Experience the difference with the FS32K146HAT0VLLR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to external elements, making the product suitable for various environments.

Integrated Cache: YES

Having an integrated cache improves the performance of the microcontroller by reducing memory access time and increasing processing speed.

Maximum Supply Voltage: 5.5 V

The higher supply voltage allows the microcontroller to handle a wider range of applications and power requirements.

On Chip Data RAM Width: 8

With a wider data RAM width, the microcontroller can process larger amounts of data efficiently.

Surface Mount: YES

Surface mount capability makes installation and integration of the microcontroller easier and more convenient.

No. of Terminals: 100

Having a higher number of terminals provides more connectivity options and flexibility in interfacing with other components.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function effectively in cold environments.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data for processing.

DMA Channels: YES

DMA channels improve data transfer efficiency by allowing direct memory access without CPU intervention.

Technical Specifications

Microcontrollers FS32K146HAT0VLLR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

89

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

50

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

80 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, LIN(3), LPUART(3), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(50), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K146HAT0VLLR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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