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FS32K144URT0VLHT

NXP Semiconductors

FS32K144URT0VLHT by NXP Semiconductors

FS32K144URT0VLHT by NXP: 32-bit microcontroller with 40MHz clock, 64 terminals, and ADC/DMA channels. Ideal for applications requiring high-speed processing and multiple I/O lines in a compact square package.

Median Price

$7.143

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,600 parts In-Stock

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Vyrian

USA . 8,912 parts In-Stock

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Chip Stock

USA . 7,800 parts In-Stock

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Digiode

USA . 3,065 parts In-Stock

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Anansix

USA . 1,212 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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One Stop Electronics

USA . 285 parts In-Stock

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$5.000

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Ampacity Inc.

Singapore . 1,499 parts In-Stock

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$8.000

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Vigor

Singapore . 513 parts In-Stock

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$10.040

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AZTECH Wire

Italy . 816 parts In-Stock

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Corohmni

South Africa . 907 parts In-Stock

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Microchip USA

USA . 2,793 parts In-Stock

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Aztec Data Supply Inc.

USA . 509 parts In-Stock

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Lixinc

USA . 11,082 parts In-Stock

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Continental Prestige Electronics

USA . 4,415 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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UNI Independent Distributors

Spain . 3,078 parts In-Stock

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Argo Parts USA

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Corphita

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Aranea Global

USA . 100 parts In-Stock

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Overview

Discover the innovative FS32K144URT0VLHT microcontroller by NXP Semiconductors, designed to deliver superior performance and reliability. With advanced features like ADC and DMA channels, this product offers endless possibilities for a variety of applications. Experience seamless integration with its surface mount design and low profile package shape, making it ideal for space-constrained projects. Trust in NXP Semiconductors' reputation for quality and precision engineering, and unlock the full potential of your next project with the FS32K144URT0VLHT.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy assembly on PCBs, saving time and cost in the manufacturing process.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage levels, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape is more space-efficient and allows for better placement on the PCB.

Bit Size: 32

32-bit architecture offers higher processing power and efficiency compared to lower-bit microcontrollers.

No. of Terminals: 64

Ample number of terminals provide connectivity options for various external components and peripherals.

Package Style: FLATPACK, LOW PROFILE

Low profile package style saves space and allows for compact designs.

Minimum Supply Voltage: 2.7 V

Can operate at lower voltage levels, helping to conserve power.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to process analog signals from sensors.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and reduce CPU workload.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection to the PCB.

Width: 10 mm

Compact width makes the microcontroller suitable for applications where space is limited.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand higher temperatures for longer durations during soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering and durability.

Length: 10 mm

Compact length complements the width for a space-efficient design.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing capabilities for embedded applications.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and mechanical strength for reliable connections.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage compatibility for easy integration into existing systems.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of output signals for applications like motor control.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high density mounting on the PCB, saving space.

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity level to moisture ensures reliability in various environmental conditions.

Speed: 112 rpm

Operating speed of 112 rpm indicates efficient performance for real-time applications.

No. of I/O Lines: 58

Ample I/O lines provide flexibility for connecting external devices and peripherals.

Technical Specifications

Microcontrollers FS32K144URT0VLHT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

58

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Speed:

112 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

FS32K144URT0VLHT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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