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FS32K144UAT0VMHT

NXP Semiconductors

FS32K144UAT0VMHT by NXP Semiconductors

NXP Semiconductors' FS32K144UAT0VMHT is a 32-bit microcontroller with Cortex-M4F CPU, 40 MHz clock frequency, and 524288 ROM words. It features 16-Ch 12-Bit ADC, CAN, I2C, LIN, LPUART, SPI connectivity for automotive applications. With low power mode and ISO 26262 screening level, it's ideal for high-performance embedded systems.

Median Price

$5.850

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,130 parts In-Stock

1+ parts

$5.340

100+ parts

-

1k+ parts

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10k+ parts

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1,130

$5.340

-

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Chip1Stop

Japan . 880 parts In-Stock

1+ parts

$9.900

100+ parts

$6.080

1k+ parts

$5.520

10k+ parts

$5.330

880

$9.900

$6.080

$5.520

$5.330

Rochester

USA . 2,661 parts In-Stock

1+ parts

-

100+ parts

$4.550

1k+ parts

$4.070

10k+ parts

$3.830

2,661

-

$4.550

$4.070

$3.830

Verical

USA . 880 parts In-Stock

1+ parts

-

100+ parts

$6.360

1k+ parts

$5.780

10k+ parts

-

880

-

$6.360

$5.780

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.990

100+ parts

-

1k+ parts

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50

$7.990

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Digiode

USA . 4,012 parts In-Stock

1+ parts

$9.595

100+ parts

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10k+ parts

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4,012

$9.595

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Vyrian

USA . 4,015 parts In-Stock

1+ parts

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100+ parts

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4,015

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Flip Electronics

USA . 2,661 parts In-Stock

1+ parts

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2,661

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Anansix

USA . 1,057 parts In-Stock

1+ parts

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1,057

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 430 parts In-Stock

1+ parts

$6.850

100+ parts

-

1k+ parts

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10k+ parts

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430

$6.850

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Netroflash

USA . 500 parts In-Stock

1+ parts

$7.990

100+ parts

-

1k+ parts

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10k+ parts

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500

$7.990

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Corphita

USA . 3,563 parts In-Stock

1+ parts

$9.090

100+ parts

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10k+ parts

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3,563

$9.090

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AZTECH Wire

Italy . 632 parts In-Stock

1+ parts

$9.800

100+ parts

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632

$9.800

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Vigor

Singapore . 500 parts In-Stock

1+ parts

$12.210

100+ parts

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500

$12.210

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Microchip USA

USA . 2,995 parts In-Stock

1+ parts

$25.364

100+ parts

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1k+ parts

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10k+ parts

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2,995

$25.364

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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UNI Independent Distributors

Spain . 2,609 parts In-Stock

1+ parts

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100+ parts

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2,609

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Overview

Unlock the power of innovation with the FS32K144UAT0VMHT by NXP Semiconductors. This cutting-edge microcontroller offers unparalleled quality and reliability, perfect for a wide range of applications. With integrated cache, low power mode, and a variety of peripherals, this product provides exceptional value and benefits to customers looking to bring their designs to life. Trust in NXP Semiconductors to deliver superior performance and efficiency, setting you apart from the competition. Elevate your projects with the FS32K144UAT0VMHT and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and lightweight characteristics, making it suitable for various applications.

Integrated Cache: YES

The integrated cache helps improve the speed and efficiency of data retrieval and processing tasks.

Surface Mount: YES

The surface mount design allows for easy and secure installation on circuit boards.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage provides flexibility in power input options for different system requirements.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient storage and retrieval of data during processing tasks.

Screening Level: ISO 26262

Compliance with ISO 26262 safety standards ensures reliable operation and protection against system failures.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB layout.

Bit Size: 32

The 32-bit architecture enables fast and efficient data processing operations.

No. of Terminals: 100

The high number of terminals provides versatility in connectivity options with other components.

Package Style: GRID ARRAY, LOW PROFILE

The low profile grid array package style offers a compact form factor suitable for space-constrained applications.

Minimum Supply Voltage: 2.7 V

The lower minimum supply voltage enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range allows for reliable performance in harsh environmental conditions.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high performance and energy efficiency for demanding tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation in cold environments.

Terminal Finish: TIN SILVER

The tin silver terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

The presence of ADC channels allows for analog signal conversion for precise measurements and sensor interfacing.

DMA Channels: YES

The availability of DMA channels enables efficient data transfer between peripherals and memory without CPU intervention.

Technical Specifications

Microcontrollers FS32K144UAT0VMHT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e2

Length:

11 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

89

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

34

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,39

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.41 mm

Speed:

112 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, LIN(3), LPUART(3), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(34), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K144UAT0VMHT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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