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FS32K144HFT0VLFR

NXP Semiconductors

FS32K144HFT0VLFR by NXP Semiconductors

NXP Semiconductors' FS32K144HFT0VLFR is a 32-bit microcontroller with Cortex-M4F CPU, 524288 ROM words, and 65536 RAM bytes. It features 16-Ch 12-Bit ADCs, CAN, I2C, LIN, LPUART, SPI connectivity for automotive applications. Operating at up to 40 MHz with low power mode support and ISO 26262 screening level.

Median Price

$4.329

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 10,000 parts In-Stock

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Vyrian

USA . 4,925 parts In-Stock

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Anansix

USA . 535 parts In-Stock

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Digiode

USA . 153 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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One Stop Electronics

USA . 654 parts In-Stock

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AZTECH Wire

Italy . 875 parts In-Stock

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Microchip USA

USA . 4,444 parts In-Stock

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$15.049

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Aztec Data Supply Inc.

USA . 2,005 parts In-Stock

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$19.857

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Ampacity Inc.

Singapore . 1,510 parts In-Stock

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$21.000

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Corohmni

South Africa . 66 parts In-Stock

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Continental Prestige Electronics

USA . 3,520 parts In-Stock

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UNI Independent Distributors

Spain . 2,531 parts In-Stock

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Aranea Global

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Corphita

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Argo Parts USA

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Overview

Unlock the power of innovation with the FS32K144HFT0VLFR microcontroller by NXP Semiconductors. Designed to deliver exceptional performance, this product boasts integrated cache and a wide range of peripherals, making it ideal for a variety of applications. Whether you're looking to design smart devices or automotive systems, this microcontroller offers unmatched reliability and efficiency. Trust in NXP Semiconductors' legacy of quality and expertise, and elevate your projects to new heights with the FS32K144HFT0VLFR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability for the microcontroller package, ensuring long-term performance.

Integrated Cache: YES

Having an integrated cache improves the microcontroller's processing speed and efficiency, making it suitable for handling complex tasks.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

On Chip Data RAM Width: 8

A wider on-chip data RAM width enables faster data processing and storage capabilities, enhancing the overall performance of the microcontroller.

Screening Level: ISO 26262

Compliance with ISO 26262 ensures that the microcontroller meets strict safety standards, making it suitable for use in automotive and other safety-critical applications.

ROM Words: 524288

With a large ROM capacity, the microcontroller can store a vast amount of program data, allowing for complex algorithms and software applications to be run efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient processing of instructions and data, resulting in faster execution and lower power consumption.

No. of Timers: 34

Having a high number of timers allows for precise timing control in various applications, making the microcontroller suitable for tasks requiring accurate time measurement.

RAM Bytes: 65536

With a large RAM capacity, the microcontroller can efficiently handle a large amount of data processing and storage, improving overall system performance.

Technical Specifications

Microcontrollers FS32K144HFT0VLFR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

43

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

34

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, LIN(3), LPUART(3), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(34), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K144HFT0VLFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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