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FS32K144HAT0MMHR

NXP Semiconductors

FS32K144HAT0MMHR by NXP Semiconductors

NXP Semiconductors' FS32K144HAT0MMHR microcontroller features 32-bit CPU, 40 MHz clock frequency, and 524288 ROM words. Ideal for automotive applications requiring ISO 26262 screening, it offers low power mode, CAN/I2C/SPI connectivity, and 16-channel ADC for versatile performance in a compact package.

Median Price

$5.457

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,000 parts In-Stock

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Vyrian

USA . 4,835 parts In-Stock

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Digiode

USA . 3,052 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Anansix

USA . 107 parts In-Stock

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One Stop Electronics

USA . 355 parts In-Stock

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AZTECH Wire

Italy . 557 parts In-Stock

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Semicontronic

India . 832 parts In-Stock

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$20.000

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$19.500

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$19.400

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Microchip USA

USA . 2,687 parts In-Stock

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$24.687

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Ampacity Inc.

Singapore . 279 parts In-Stock

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$32.000

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UNI Independent Distributors

Spain . 6,606 parts In-Stock

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Continental Prestige Electronics

USA . 6,155 parts In-Stock

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Argo Parts USA

USA . 4,502 parts In-Stock

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Corphita

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Vigor

Singapore . 381 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unleash the power of innovation with the FS32K144HAT0MMHR microcontroller by NXP Semiconductors. As a leader in cutting-edge technology, NXP delivers top-of-the-line quality and reliability in every product. This versatile microcontroller is perfect for a wide range of applications, offering unparalleled performance and efficiency. Experience seamless connectivity, advanced features, and exceptional value with the FS32K144HAT0MMHR. Take your projects to the next level with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and lightweight, suitable for various applications.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency, making this microcontroller a high-performance choice.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving time and effort in the production process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, increasing its versatility.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 bits enables faster data processing and storage capabilities, enhancing performance.

Screening Level: ISO 26262

The ISO 26262 screening level ensures high reliability and safety standards, making this microcontroller a reliable choice for critical applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, making it suitable for compact designs.

Bit Size: 32

The 32-bit size ensures higher data processing capabilities, making this microcontroller a powerful choice for complex tasks.

No. of Terminals: 100

With 100 terminals, this microcontroller offers ample connectivity options, suitable for devices requiring multiple input/output connections.

Package Style: GRID ARRAY, LOW PROFILE

The grid array, low profile package style ensures easy integration into various systems with minimal space requirements.

Technical Specifications

Microcontrollers FS32K144HAT0MMHR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e2

Length:

11 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

89

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

34

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,39

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.41 mm

Speed:

80 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, LIN(3), LPUART(3), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(34), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K144HAT0MMHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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