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FS32K142MAT0MLLT

NXP Semiconductors

FS32K142MAT0MLLT by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Technology: CMOS;

Median Price

$5.714

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 450 parts In-Stock

1+ parts

$22.400

100+ parts

$14.000

1k+ parts

$13.300

10k+ parts

-

450

$22.400

$14.000

$13.300

-

Verical

USA . 9,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.714

10k+ parts

-

9,900

-

-

$5.714

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Rochester

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$5.000

1k+ parts

$4.470

10k+ parts

$4.210

900

-

$5.000

$4.470

$4.210

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,903 parts In-Stock

1+ parts

$13.851

100+ parts

-

1k+ parts

-

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1,903

$13.851

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-

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Vyrian

USA . 5,691 parts In-Stock

1+ parts

-

100+ parts

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5,691

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Anansix

USA . 2,172 parts In-Stock

1+ parts

-

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2,172

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 529 parts In-Stock

1+ parts

$0.428

100+ parts

-

1k+ parts

-

10k+ parts

$0.411

529

$0.428

-

-

$0.411

Northwest PG Solutions

USA . 2,260 parts In-Stock

1+ parts

$0.471

100+ parts

-

1k+ parts

-

10k+ parts

$0.415

2,260

$0.471

-

-

$0.415

Vigor

Singapore . 255 parts In-Stock

1+ parts

$10.120

100+ parts

-

1k+ parts

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255

$10.120

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-

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Corphita

USA . 2,462 parts In-Stock

1+ parts

$13.122

100+ parts

-

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2,462

$13.122

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AZTECH Wire

Italy . 941 parts In-Stock

1+ parts

$15.950

100+ parts

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941

$15.950

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Microchip USA

USA . 2,167 parts In-Stock

1+ parts

$46.305

100+ parts

-

1k+ parts

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10k+ parts

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2,167

$46.305

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UNI Independent Distributors

Spain . 5,356 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,356

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Technical Specifications

Microcontrollers FS32K142MAT0MLLT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

89

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(2), I2C, SPI(2), UART(2)

Peripherals:

ANALOG COMPARATOR, CRC, DMA(16), POR, PWM, RTC, TIMER(8), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

FS32K142MAT0MLLT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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