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FS32K116LIT0VFMR

NXP Semiconductors

FS32K116LIT0VFMR by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

Median Price

$2.298

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 2,500 parts In-Stock

1+ parts

-

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-

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2,500

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Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

1+ parts

-

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2,500

-

-

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Verical

USA . 1,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.425

10k+ parts

$2.275

1,198

-

-

$2.425

$2.275

Rochester

USA . 1,198 parts In-Stock

1+ parts

-

100+ parts

$2.170

1k+ parts

$1.940

10k+ parts

$1.820

1,198

-

$2.170

$1.940

$1.820

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,500

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-

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TME

Poland . 2,500 parts In-Stock

1+ parts

-

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$2.890

2,500

-

-

-

$2.890

Vyrian

USA . 2,052 parts In-Stock

1+ parts

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2,052

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Digiode

USA . 597 parts In-Stock

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597

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Anansix

USA . 509 parts In-Stock

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509

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Sensible Micro Corp

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 891 parts In-Stock

1+ parts

$5.523

100+ parts

-

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891

$5.523

-

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Vigor

Singapore . 135 parts In-Stock

1+ parts

$6.463

100+ parts

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135

$6.463

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AZTECH Wire

Italy . 987 parts In-Stock

1+ parts

$17.530

100+ parts

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987

$17.530

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Microchip USA

USA . 4,926 parts In-Stock

1+ parts

$30.039

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4,926

$30.039

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UNI Independent Distributors

Spain . 6,940 parts In-Stock

1+ parts

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6,940

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,390 parts In-Stock

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2,390

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Northwest PG Solutions

USA . 1,565 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$5.413

10k+ parts

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1,565

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$5.413

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Technical Specifications

Microcontrollers FS32K116LIT0VFMR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

28

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

17408

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

.85 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN, I2C, LIN(2), LPUART(2), SPI

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(18), WDT

Analog To Digital Convertors:

13-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K116LIT0VFMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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