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FS32K116LAT0MLFR

NXP Semiconductors

FS32K116LAT0MLFR by NXP Semiconductors

NXP Semiconductors' FS32K116LAT0MLFR is a 32-bit microcontroller with Cortex-M0+ CPU, 131072 ROM words, and 2048 data EEPROM size. It features 13-Ch 12-Bit ADCs, CAN, I2C, LIN(2), LPUART(2), SPI connectivity for automotive applications. Operating at up to 40 MHz with low power mode and ISO 26262 screening level.

Median Price

$4.905

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,380 parts In-Stock

1+ parts

$6.580

100+ parts

$3.710

1k+ parts

$3.030

10k+ parts

$2.690

1,380

$6.580

$3.710

$3.030

$2.690

EBV Elektronik

Germany . 50,000 parts In-Stock

1+ parts

-

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Verical

USA . 16,000 parts In-Stock

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$3.230

16,000

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$3.230

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.410

100+ parts

-

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10

$5.410

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Digiode

USA . 2,498 parts In-Stock

1+ parts

$7.961

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2,498

$7.961

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TME

Poland . 16,000 parts In-Stock

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$3.340

16,000

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$3.340

Chip Stock

USA . 10,600 parts In-Stock

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10,600

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Vyrian

USA . 6,839 parts In-Stock

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6,839

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Anansix

USA . 1,002 parts In-Stock

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ComSIT Distribution GmbH

Germany . 188 parts In-Stock

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188

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$5.302

100+ parts

-

1k+ parts

$5.090

10k+ parts

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2,000

$5.302

-

$5.090

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Continental Prestige Electronics

USA . 135 parts In-Stock

1+ parts

$5.410

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$5.302

135

$5.410

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-

$5.302

Ampacity Inc.

Singapore . 683 parts In-Stock

1+ parts

$7.480

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683

$7.480

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Corphita

USA . 100 parts In-Stock

1+ parts

$7.542

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100

$7.542

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AZTECH Wire

Italy . 404 parts In-Stock

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$10.884

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404

$10.884

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Microchip USA

USA . 4,655 parts In-Stock

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$30.977

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4,655

$30.977

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Lixinc

USA . 5,856 parts In-Stock

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5,856

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Epart123

USA . 4,000 parts In-Stock

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$44.200

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$44.200

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$44.200

UNI Independent Distributors

Spain . 2,554 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,860 parts In-Stock

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Vigor

Singapore . 237 parts In-Stock

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237

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Overview

Unleash the power of innovation with the FS32K116LAT0MLFR by NXP Semiconductors. As a leading manufacturer of high-quality microcontrollers, NXP delivers cutting-edge technology that exceeds industry standards. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers seeking reliable performance and efficiency. Experience seamless connectivity, advanced features, and exceptional functionality with the FS32K116LAT0MLFR - the perfect solution for your next project. Elevate your creations to new heights with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable and rugged applications.

Integrated Cache: YES

The presence of integrated cache enhances the processing speed and efficiency of the microcontroller, making it suitable for applications requiring high performance.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, making it versatile for different applications.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 enhances the storage and processing capabilities of the microcontroller, making it suitable for complex tasks.

Screening Level: ISO 26262

The ISO 26262 screening level ensures the reliability and safety of the microcontroller, making it a trusted choice for mission-critical applications.

Package Shape: SQUARE

The square package shape allows for compact and efficient layout on the PCB, maximizing space utilization in tight designs.

Bit Size: 32

The 32-bit architecture of this microcontroller provides enhanced processing power and performance, suitable for demanding applications.

No. of Terminals: 48

With 48 terminals, this microcontroller allows for a wide range of connectivity options, making it versatile for various interfaces and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers a compact and space-saving design for applications with size constraints.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement allows for efficient power management and operation in low-power scenarios, ideal for battery-powered devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance of 125°C ensures reliable performance in harsh environmental conditions.

Terminal Finish: TIN

The TIN terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable operation.

ADC Channels: YES

The presence of ADC channels allows for analog signal conversion, making this microcontroller suitable for applications requiring sensor interfacing and data acquisition.

DMA Channels: YES

The availability of DMA channels enables efficient data transfer and processing, improving overall system performance in data-intensive applications.

Technical Specifications

Microcontrollers FS32K116LAT0MLFR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

43

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

17408

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN, I2C, LIN(2), LPUART(2), SPI

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(18), WDT

Analog To Digital Convertors:

13-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K116LAT0MLFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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