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DAC1408D750HN/C1,5

NXP Semiconductors

DAC1408D750HN/C1,5 by NXP Semiconductors

DAC1408D750HN/C1,5 by NXP Semiconductors is a 14-bit D/A converter designed for industrial applications. It operates at 1.8/3.3V with a max temp of 85 °C and features a compact chip carrier package with no lead terminals. Ideal for precision signal processing in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,985 parts In-Stock

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Anansix

USA . 2,821 parts In-Stock

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Digiode

USA . 520 parts In-Stock

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520

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Native Components

USA . 924 parts In-Stock

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$1.202

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Northwest PG Solutions

USA . 2,051 parts In-Stock

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$1.322

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2,051

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One Stop Electronics

USA . 577 parts In-Stock

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$8.000

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577

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AZTECH Wire

Italy . 695 parts In-Stock

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$12.140

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Ampacity Inc.

Singapore . 455 parts In-Stock

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$38.000

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455

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Component Stockers USA

USA . 239 parts In-Stock

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$99.990

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UNI Independent Distributors

Spain . 8,122 parts In-Stock

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Microchip USA

USA . 4,979 parts In-Stock

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Corphita

USA . 3,928 parts In-Stock

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Overview

Unlock the potential of your designs with the DAC1408D750HN/C1,5 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP offers a robust digital-to-analog converter that excels in precision and reliability. Ideal for industrial applications, this device ensures superior performance across temperature ranges, empowering engineers to create cutting-edge solutions. Elevate your projects with a product designed for excellence—experience unmatched value and benefits today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental conditions, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier integration into modern electronic circuits.

No. of Functions: 2

With two functions available, this D/A converter offers versatility, enabling more complex applications within a single component.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, facilitating efficient circuit layout and design.

No. of Bits: 14

The 14-bit resolution ensures high precision in digital-to-analog conversion, making it ideal for applications requiring fine detail.

Power Supplies (V): 1.8/3.3

Support for dual voltage options allows compatibility with a wide range of systems and power requirements.

No. of Terminals: 64

A higher number of terminals enables extensive connectivity and functionality, suitable for complex designs.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging enhances thermal performance and electrical characteristics, improving overall reliability.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C ensures reliability in demanding environments, expanding application possibilities.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this converter can function in extreme cold conditions, suitable for industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, enhancing the longevity of the product.

Terminal Position: QUAD

Quad terminal position aids in compact designs and efficient wiring configurations, beneficial for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature characteristics indicate suitability for harsh environments typical in industrial applications.

Terminal Form: NO LEAD

No lead terminal form reduces environmental impact while allowing for a smaller footprint on the PCB.

Converter Type: D/A CONVERTER

Being a digital-to-analog converter makes this product essential for bridging digital systems to analog outputs, useful in countless applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for denser layouts, maximizing design flexibility in compact electronics.

Input Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Support for multiple input bit codes increases interoperability with various systems, enhancing the converter's usability.

Technical Specifications

Digital-to-Analog Converters DAC1408D750HN/C1,5 attributes and parameters. Explore more Digital-to-Analog Converters devices from NXP Semiconductors

Converter Specifications

Sub-Category:

Other Converters

Input Bit Code:

Offset Binary, 2's Complement Binary

No. of Bits:

14

No. of Functions:

2

Electrical Specifications

Power Supplies:

1.8/3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

64

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Matte Tin

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Trade Compliance

DAC1408D750HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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