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DAC1208D650HN/C1,5

NXP Semiconductors

DAC1208D650HN/C1,5 by NXP Semiconductors

DAC1208D650HN/C1,5 by NXP Semiconductors is a 12-bit D/A converter designed for industrial applications. It operates at power supplies of 1.8/3.3V and features a compact no-lead chip carrier package with a max temp of 85 °C. Ideal for precision signal generation in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,657 parts In-Stock

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Anansix

USA . 2,533 parts In-Stock

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2,533

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Digiode

USA . 474 parts In-Stock

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474

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Distributors (Availability)

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AZTECH Wire

Italy . 528 parts In-Stock

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$21.170

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528

$21.170

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Corohmni

South Africa . 208 parts In-Stock

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$24.709

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208

$24.709

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One Stop Electronics

USA . 495 parts In-Stock

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$31.000

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495

$31.000

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Native Components

USA . 516 parts In-Stock

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$493.719

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$483.845

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$478.907

10k+ parts

$473.970

516

$493.719

$483.845

$478.907

$473.970

Northwest PG Solutions

USA . 1,387 parts In-Stock

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$543.091

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QUARKTWIN TECHNOLOGY LTD

USA . 19,613 parts In-Stock

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Microchip USA

USA . 10,852 parts In-Stock

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UNI Independent Distributors

Spain . 7,636 parts In-Stock

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Corphita

USA . 4,776 parts In-Stock

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Overview

Unlock premium performance with the DAC1208D650HN/C1,5 from NXP Semiconductors—a trusted name in the industry. This advanced digital-to-analog converter delivers exceptional precision and reliability for a wide range of applications, from industrial automation to audio systems. With robust design features that withstand extreme conditions, it ensures consistent operation while maximizing efficiency. Experience superior quality and innovation that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space.

No. of Functions: 2

Having multiple functions enhances versatility and reduces the need for additional components in a circuit.

Package Shape: SQUARE

The square shape aids in uniform thermal and electrical performance, contributing to improved reliability.

No. of Bits: 12

A 12-bit resolution provides excellent accuracy and fidelity for a wide range of applications.

Power Supplies (V): 1.8/3.3

Dual power supply options expand compatibility with various systems and reduce power consumption.

No. of Terminals: 64

A high number of terminals enables complex connections and facilitates robust performance in integrated designs.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging supports efficient heat dissipation and allows for advanced circuit layouts.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it is suitable for industrial applications where thermal management is crucial.

Minimum Operating Temperature: -40 °C

This feature ensures reliable performance in extreme cold environments, enhancing application versatility.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability while preventing oxidation, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positioning allows for simplified routing on PCBs, promoting efficient design processes.

Temperature Grade: INDUSTRIAL

Industrial temperature grading assures operation in harsh environments, thus boosting reliability and longevity.

Terminal Form: NO LEAD

No lead design enhances the environmental compliance of the product, adhering to RoHS standards.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, it is essential for applications requiring seamless conversion of digital signals to analog, critical in audio and video processing.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density designs, allowing more components to fit into limited space.

Input Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Support for multiple input bit codes enhances flexibility, accommodating a wider range of digital signal formats.

Technical Specifications

Digital-to-Analog Converters DAC1208D650HN/C1,5 attributes and parameters. Explore more Digital-to-Analog Converters devices from NXP Semiconductors

Converter Specifications

Sub-Category:

Other Converters

Input Bit Code:

Offset Binary, 2's Complement Binary

No. of Bits:

12

No. of Functions:

2

Electrical Specifications

Power Supplies:

1.8/3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

64

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Matte Tin

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Trade Compliance

DAC1208D650HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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