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BZX84-C18,235

NXP Semiconductors

BZX84-C18,235 by NXP Semiconductors

NXP Semiconductors' BZX84-C18,235 Zener Diode has a nominal reference voltage of 18V and max power dissipation of 0.25W. With a working test current of 5mA, it is ideal for applications requiring precise voltage regulation in compact electronic circuits. The diode's small outline package and surface mount capability make it suitable for space-constrained designs where temperature ranges from -65 to 150°C are encountered.

Median Price

$0.028

Lifecycle Status

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Chip1Stop

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Adafruit Industries

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TTI

USA . 730,000 parts In-Stock

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Farnell

UK . 124,740 parts In-Stock

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EBV Elektronik

Germany . 60,000 parts In-Stock

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Verical

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Rochester

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Arrow

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Digiode

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Nova Conductors

Japan . 53 parts In-Stock

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Chip Stock

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DigiKey Marketplace

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IBS Electronics

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NAC Semi

USA . 80,000 parts In-Stock

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Vyrian

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Anansix

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PC Components Company LLC

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Bristol Electronics

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Cyclops Electronics Ltd

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Semicontronic

India . 667,621 parts In-Stock

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Corphita

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Argo Parts USA

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Ampacity Inc.

Singapore . 617,473 parts In-Stock

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AZTECH Wire

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Modulus Dynamics

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Aztec Data Supply Inc.

USA . 4,435 parts In-Stock

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Corohmni

South Africa . 250 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Perfect Parts

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Eastek

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Continental Prestige Electronics

USA . 124,740 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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Overview

Unlock the power of precision with the NXP Semiconductors BZX84-C18,235 Zener Diode. Manufactured with top-quality materials and cutting-edge technology, this single-configured diode offers unparalleled performance and reliability. Ideal for a wide range of applications, from voltage regulation to signal conditioning, this small outline diode provides a maximum voltage tolerance of 5% and a nominal reference voltage of 18V. Experience the value and benefits of this high-quality product, designed to meet your needs with maximum efficiency and precision.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

The use of plastic/epoxy body material ensures durability and resistance to external elements, making it a reliable choice for long-term use.

Config SINGLE

Single configuration simplifies the setup process and reduces the chances of errors, making it user-friendly and easy to integrate into circuits.

Working Test Current 5 mA

With a working test current of 5 mA, this zener diode offers stable and consistent performance, ideal for low-power applications.

Surface Mount YES

The surface mount feature allows for easy installation and saves space on the circuit board, making it suitable for compact designs.

Maximum Reverse Current 0.05 uA

The low maximum reverse current of 0.05 uA ensures minimal power loss and prevents overheating, enhancing the overall efficiency of the diode.

Package Shape RECTANGULAR

The rectangular package shape facilitates easy placement and alignment on the circuit board, ensuring a secure fit and reliable connection.

No. of Terminals 3

With three terminals, this zener diode provides flexibility in circuit design and offers multiple connection options for enhanced functionality.

Package Style (Meter) SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting, making it suitable for applications with limited board space.

Maximum Voltage Tolerance 5 %

The tight maximum voltage tolerance of 5% ensures accurate and precise voltage regulation, making it a reliable choice for critical applications.

Maximum Operating Temperature 150 °C

With a high maximum operating temperature of 150°C, this zener diode can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Technical Specifications

Zener Diodes BZX84-C18,235 attributes and parameters. Explore more Zener Diodes devices from NXP Semiconductors

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

45 ohm

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.25 W

Qualification:

Not Qualified

Nominal Reference Voltage:

18 V

Maximum Reverse Current:

.05 uA

Sub-Category:

Voltage Reference Diodes

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Temperature Coefficient:

16 mV/Cel

Maximum Voltage Tolerance:

5 %

Working Test Current:

5 mA

Trade Compliance

BZX84-C18,235 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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