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BZA100

NXP Semiconductors

BZA100 by NXP Semiconductors

TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 20; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 25,030 parts In-Stock

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Dan-Mar Components

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Bristol Electronics

USA . 12,817 parts In-Stock

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Electronics Depot

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ACDS - Activité Composants Distribution Service

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Vyrian

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Inventory MP

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Semi Source

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Digiode

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ECAB

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Anansix

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Component Electronics Inc.

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Prism Electronics

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LIBRA Elektronik GmbH

Germany . 10 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 691 parts In-Stock

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$0.010

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Native Components

USA . 1,153 parts In-Stock

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Northwest PG Solutions

USA . 1,981 parts In-Stock

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AZTECH Wire

Italy . 3,208 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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UNI Independent Distributors

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Corphita

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Supply Digital

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Perfect Parts

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Technical Specifications

Transient Suppression Devices BZA100 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Nominal Breakdown Voltage:

6.8 V

Maximum Clamping Voltage:

11 V

Config:

COMMON ANODE, 18 ELEMENTS

Minimum Diode Capacitance:

120 pF

Diode Element Material:

SILICON

JEDEC-95 Code:

MS-013AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

27.5 W

No. of Elements:

18

No. of Terminals:

20

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

1.25 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

7.2 V

Maximum Reverse Current:

2 uA

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BZA100 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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