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BYC5X-600P,127

NXP Semiconductors

BYC5X-600P,127 by NXP Semiconductors

RECTIFIER DIODE; Terminal Position: SINGLE; Terminal Form: THROUGH-HOLE; No. of Terminals: 2; Surface Mount: NO; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,029 parts In-Stock

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3,029

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Vyrian

USA . 2,485 parts In-Stock

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2,485

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Anansix

USA . 2,115 parts In-Stock

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2,115

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Distributors (Availability)

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One Stop Electronics

USA . 947 parts In-Stock

1+ parts

$2.010

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947

$2.010

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Native Components

USA . 825 parts In-Stock

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$11.760

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825

$11.760

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Northwest PG Solutions

USA . 2,117 parts In-Stock

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$12.936

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$11.642

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2,117

$12.936

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QUARKTWIN TECHNOLOGY LTD

USA . 25,498 parts In-Stock

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Microchip USA

USA . 5,019 parts In-Stock

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Corphita

USA . 3,553 parts In-Stock

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UNI Independent Distributors

Spain . 1,896 parts In-Stock

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Technical Specifications

Diodes & Rectifiers BYC5X-600P,127 attributes and parameters. Explore more Diodes & Rectifiers devices from NXP Semiconductors

Specs

Additional Features:

LOW LEAKAGE CURRENT

Application:

HYPER FAST RECOVERY POWER

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

3.3 V

JEDEC-95 Code:

TO-220AC

JESD-30 Code:

R-PSFM-T2

Maximum Non Repetitive Peak Forward Current:

65 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Reference Standard:

IEC-60134

Maximum Repetitive Peak Reverse Voltage:

600 V

Maximum Reverse Current:

10 uA

Maximum Reverse Recovery Time:

.025 us

Surface Mount:

NO

Terminal Form:

Terminal Position:

Trade Compliance

BYC5X-600P,127 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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