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BUK221-50DY

NXP Semiconductors

BUK221-50DY by NXP Semiconductors

N-CHANNEL; Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Package Shape: RECTANGULAR; No. of Terminals: 6; Terminal Form: GULL WING;

Median Price

$5.710

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 16,000 parts In-Stock

1+ parts

$5.710

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$5.710

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ComSIT Distribution GmbH

Germany . 7,200 parts In-Stock

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Bristol Electronics

USA . 3,200 parts In-Stock

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3,200

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Q Components

USA . 1,506 parts In-Stock

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1,506

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Microfarads

USA . 1,488 parts In-Stock

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Anansix

USA . 1,028 parts In-Stock

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Digiode

USA . 418 parts In-Stock

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Vyrian

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Distributors (Availability)

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$0.772

100+ parts

$0.765

1k+ parts

$0.734

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3,000

$0.772

$0.765

$0.734

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One Stop Electronics

USA . 1,201 parts In-Stock

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$56.050

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$56.050

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Alle Elektronik GmbH

Germany . 4,536 parts In-Stock

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Corphita

USA . 4,175 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Kepictronics

USA . 2,400 parts In-Stock

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Northwest PG Solutions

USA . 2,038 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Native Components

USA . 958 parts In-Stock

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958

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Perfect Parts

USA . 132 parts In-Stock

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UNI Independent Distributors

Spain . 63 parts In-Stock

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63

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Technical Specifications

Power Field Effect Transistors (FET) BUK221-50DY attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Avalanche Energy Rating (EAS):

60 mJ

Minimum DS Breakdown Voltage:

45 V

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BUK221-50DY Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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