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BR211-159

NXP Semiconductors

BR211-159 by NXP Semiconductors

SYMMETRICAL BOD; Package Style (Meter): LONG FORM; Surface Mount: NO; Terminal Position: AXIAL; Configuration: SINGLE; Case Connection: ISOLATED;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,453 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,453

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Digiode

USA . 1,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,080

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Anansix

USA . 731 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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731

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 290 parts In-Stock

1+ parts

$20.100

100+ parts

-

1k+ parts

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10k+ parts

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290

$20.100

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Native Components

USA . 39 parts In-Stock

1+ parts

$1,670.000

100+ parts

$1,636.600

1k+ parts

$1,619.900

10k+ parts

$1,603.200

39

$1,670.000

$1,636.600

$1,619.900

$1,603.200

Northwest PG Solutions

USA . 1,978 parts In-Stock

1+ parts

$1,837.000

100+ parts

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1k+ parts

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1,978

$1,837.000

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UNI Independent Distributors

Spain . 2,418 parts In-Stock

1+ parts

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2,418

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Corphita

USA . 591 parts In-Stock

1+ parts

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591

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Technical Specifications

Breakover Diodes BR211-159 attributes and parameters. Explore more Breakover Diodes devices from NXP Semiconductors

Specs

Maximum Breakdown Voltage:

159 V

Case Connection:

Configuration:

Nominal Holding Current:

150 mA

JESD-30 Code:

O-LALF-W2

Maximum Non Repetitive Peak Forward Current:

40 A

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

GLASS

Package Shape:

ROUND

Package Style (Meter):

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

Trigger Device Type:

Trade Compliance

BR211-159 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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