Loading...

BGU7062N2Y

NXP Semiconductors

BGU7062N2Y by NXP Semiconductors

BGU7062N2Y by NXP Semiconductors is a compact analog circuit with a 5V nominal voltage and operates in extreme temperatures from -40 °C to 85 °C. It features a square, no-lead package with 16 terminals, ideal for industrial applications. This surface-mount device supports up to 250 mA current, ensuring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,249

-

-

-

-

Digiode

USA . 1,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,105

-

-

-

-

Anansix

USA . 928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

928

-

-

-

-

Elcom Components

USA . 458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

458

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 191 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

191

$2.500

-

-

-

Ampacity Inc.

Singapore . 671 parts In-Stock

1+ parts

$6.500

100+ parts

-

1k+ parts

-

10k+ parts

-

671

$6.500

-

-

-

AZTECH Wire

Italy . 1,089 parts In-Stock

1+ parts

$19.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,089

$19.750

-

-

-

Component Stockers USA

USA . 693 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

693

$99.990

-

-

-

UNI Independent Distributors

Spain . 7,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,718

-

-

-

-

Corphita

USA . 3,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,807

-

-

-

-

Native Components

USA . 580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

580

-

-

-

-

Northwest PG Solutions

USA . 479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

479

-

-

-

-

Overview

Elevate your designs with the BGU7062N2Y from NXP Semiconductors, a trusted leader in innovative semiconductor solutions. This versatile component, crafted for durability and efficiency, excels in various applications, ensuring reliability from -40 °C to 85 °C. With its compact design and robust performance, it’s ideal for advanced industrial uses. Choose NXP for quality you can count on, delivering unmatched value and performance for your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and a lightweight design, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier PCB assembly and utilizes space efficiently.

Package Shape: SQUARE

A square package shape promotes symmetrical packaging, facilitating uniform thermal and electrical performance.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V nominal supply voltage makes it compatible with a wide range of systems.

Power Supplies (V): 5

Conventional 5V power supply simplifies integration into existing designs.

No. of Terminals: 16

Having 16 terminals provides ample connections for diverse circuit requirements.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

The chip carrier with heat sink/slug design enhances thermal management, improving reliability in high-performance applications.

Maximum Operating Temperature: 85 °C

With an operating temperature of up to 85 °C, this product is suitable for various industrial environments.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C ensures functionality in extreme conditions, making it ideal for outdoor and harsh applications.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing and layout on PCBs, reducing design complexities.

Maximum Seated Height: 1.4 mm

The low seated height helps ensure compatibility with space-constrained designs and reduces interference with adjacent components.

Width (mm): 8 mm

An 8mm width makes it compact and suitable for tight spaces in various applications.

Other IC type: ANALOG CIRCUIT

Being an analog circuit type indicates versatility for signal processing applications.

Minimum Supply Voltage (Vsup): 4.75 V

A minimum supply voltage of 4.75V permits operational flexibility within a narrow voltage range.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C supports robust soldering processes, ensuring reliability during assembly.

Length: 8 mm

An 8mm length maintains a compact profile that is beneficial for space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance over a wide temperature range, suitable for challenging environments.

Maximum Supply Current (Isup): 250 mA

A maximum supply current of 250 mA allows for substantial power delivery without compromising performance.

Terminal Form: NO LEAD

The no-lead terminal form helps reduce the footprint on the PCB and allows for enhanced thermal dissipation.

Terminal Pitch: 1.42 mm

A terminal pitch of 1.42 mm enables compatibility with various PCB designs and maintains a compact arrangement.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, allowing for appropriate handling and storage practices in sensitive environments.

Maximum Supply Voltage (Vsup): 5.25 V

A maximum supply voltage of 5.25V provides design flexibility while ensuring protection against voltage spikes.

Technical Specifications

Other Function Semiconductors BGU7062N2Y attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N16

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.32SQ,55

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

250 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.42 mm

Terminal Position:

QUAD

Width (mm):

8 mm

Trade Compliance

BGU7062N2Y Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 1