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BGO387

NXP Semiconductors

BGO387 by NXP Semiconductors

RECEIVER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: GOLD; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -20 Cel; Minimum Operating Wavelength: 1290 nm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,275 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,275

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Anansix

USA . 2,584 parts In-Stock

1+ parts

-

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2,584

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Vyrian

USA . 1,688 parts In-Stock

1+ parts

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1,688

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 96 parts In-Stock

1+ parts

$1.449

100+ parts

-

1k+ parts

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96

$1.449

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Native Components

USA . 478 parts In-Stock

1+ parts

$25.040

100+ parts

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478

$25.040

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Northwest PG Solutions

USA . 879 parts In-Stock

1+ parts

$27.544

100+ parts

$24.790

1k+ parts

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879

$27.544

$24.790

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One Stop Electronics

USA . 565 parts In-Stock

1+ parts

$853.000

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565

$853.000

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UNI Independent Distributors

Spain . 1,450 parts In-Stock

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1,450

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Corphita

USA . 1,154 parts In-Stock

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1,154

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Perfect Parts

USA . 125 parts In-Stock

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125

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Technical Specifications

Fiber Optics - Receivers BGO387 attributes and parameters. Explore more Fiber Optics - Receivers devices from NXP Semiconductors

Specs

Body Height:

9.1 mm

Built-in Features:

AMPLIFIER

Emitter or Detector Type:

PIN PHOTODIODE

Fiber Optic Type:

JESD-609 Code:

e4

Mounting Feature:

Maximum Operating Temperature:

Minimum Operating Temperature:

Maximum Operating Wavelength:

1600 nm

Minimum Operating Wavelength:

1290 nm

Nominal Operating Wavelength:

1445 nm

Reception Type:

DIGITAL

Minimum Return Loss:

16 dB

Terminal Finish:

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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