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BGA2022

NXP Semiconductors

BGA2022 by NXP Semiconductors

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Voltage Standing Wave Ratio: 2;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,092 parts In-Stock

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Vyrian

USA . 2,094 parts In-Stock

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Anansix

USA . 860 parts In-Stock

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860

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ComSIT Distribution GmbH

Germany . 365 parts In-Stock

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365

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Distributors (Availability)

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Native Components

USA . 418 parts In-Stock

1+ parts

$10.861

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418

$10.861

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Northwest PG Solutions

USA . 95 parts In-Stock

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$11.947

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$10.752

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95

$11.947

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One Stop Electronics

USA . 1,578 parts In-Stock

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$37.000

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$37.000

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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A-Z Elektronik GmbH

Germany . 5,511 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,674 parts In-Stock

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UNI Independent Distributors

Spain . 2,763 parts In-Stock

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Corphita

USA . 1,941 parts In-Stock

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Technical Specifications

RF/Microwave Mixers BGA2022 attributes and parameters. Explore more RF/Microwave Mixers devices from NXP Semiconductors

Specs

Additional Features:

HIGH ISOLATION

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

10 dBm

JESD-609 Code:

e3

Mounting Feature:

No. of Terminals:

6

Maximum Operating Frequency:

2450 MHz

Minimum Operating Frequency:

880 MHz

Package Body Material:

Package Equivalence Code:

TSSOP6,.08

Power Supplies (V):

2.8

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Mixers

Maximum Supply Current:

8 mA

Technology:

Terminal Finish:

Tin (Sn)

Maximum Voltage Standing Wave Ratio:

2

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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