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AFIC31025NR1

NXP Semiconductors

AFIC31025NR1 by NXP Semiconductors

NARROW BAND HIGH POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 17; Package Body Material: PLASTIC/EPOXY; Technology: LDMOS; No. of Functions: 2;

Median Price

$52.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$52.540

1k+ parts

$47.010

10k+ parts

$44.240

1,000

-

$52.540

$47.010

$44.240

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,722

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-

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Digiode

USA . 4,161 parts In-Stock

1+ parts

-

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1k+ parts

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4,161

-

-

-

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Flip Electronics

USA . 1,946 parts In-Stock

1+ parts

-

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1,946

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-

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Anansix

USA . 1,350 parts In-Stock

1+ parts

-

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1,350

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 773 parts In-Stock

1+ parts

$0.825

100+ parts

-

1k+ parts

-

10k+ parts

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773

$0.825

-

-

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Northwest PG Solutions

USA . 856 parts In-Stock

1+ parts

$0.907

100+ parts

-

1k+ parts

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856

$0.907

-

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One Stop Electronics

USA . 1,152 parts In-Stock

1+ parts

$11.000

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1,152

$11.000

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AZTECH Wire

Italy . 106 parts In-Stock

1+ parts

$17.020

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106

$17.020

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Corphita

USA . 4,535 parts In-Stock

1+ parts

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100+ parts

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4,535

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UNI Independent Distributors

Spain . 2,218 parts In-Stock

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2,218

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Technical Specifications

RF & Microwave Amplifiers AFIC31025NR1 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Gain:

30.5 dB

Maximum Input Power (CW):

20 dBm

JESD-609 Code:

e3

Mounting Feature:

No. of Functions:

2

No. of Terminals:

17

Maximum Operating Frequency:

3100 MHz

Minimum Operating Frequency:

2400 MHz

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Power Supplies (V):

28

RF or Microwave Device Type:

Technology:

Terminal Finish:

TIN

Maximum Voltage Standing Wave Ratio:

10

Trade Compliance

AFIC31025NR1 RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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