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ADC1613S105HN/C1,5

NXP Semiconductors

ADC1613S105HN/C1,5 by NXP Semiconductors

ADC1613S105HN/C1,5 from NXP is a 16-bit A/D converter with a max linearity error of just 0.0076%. It operates b/w -40 °C to 85 °C and supports power supplies of 1.8V and 3V. Ideal for industrial applications, it features a compact chip carrier design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,257 parts In-Stock

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Digiode

USA . 3,336 parts In-Stock

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Anansix

USA . 1,433 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 687 parts In-Stock

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$0.970

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687

$0.970

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Northwest PG Solutions

USA . 156 parts In-Stock

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$1.067

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156

$1.067

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$7.963

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$7.246

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$6.530

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2,000

$7.963

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$6.530

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Corohmni

South Africa . 280 parts In-Stock

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$11.318

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280

$11.318

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One Stop Electronics

USA . 1,015 parts In-Stock

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$18.000

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AZTECH Wire

Italy . 823 parts In-Stock

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$20.580

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Component Stockers USA

USA . 390 parts In-Stock

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$99.990

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390

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Microchip USA

USA . 3,590 parts In-Stock

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3,590

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Corphita

USA . 795 parts In-Stock

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795

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UNI Independent Distributors

Spain . 767 parts In-Stock

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Overview

Unlock precision with the ADC1613S105HN/C1,5 from NXP Semiconductors—engineered for exceptional performance in demanding applications. With its robust design and superior accuracy, this 16-bit analog-to-digital converter is ideal for industrial automation, medical devices, and IoT solutions. NXP's commitment to quality ensures reliability under extreme conditions, empowering your innovations while streamlining development and reducing time-to-market. Embrace advancement with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, making it suitable for various applications while ensuring electrical insulation.

Surface Mount: YES

Facilitates compact design and high-density mounting, ideal for space-constrained applications.

Package Shape: SQUARE

Uniform shape allows for easier integration into circuit designs and efficient use of PCB space.

No. of Bits: 16

Offers high resolution, enabling precise signal conversion and superior data representation.

Maximum Linearity Error (EL): 0.0076 %

Ensures high accuracy in analog-to-digital conversions, making it suitable for precision applications.

Power Supplies (V): 1.8, 3

Flexible voltage requirements allow for compatibility with a wide range of electronic systems.

No. of Terminals: 32

Provides sufficient connectivity for various input and output configurations, enhancing versatility.

Package Style (Meter): CHIP CARRIER

Supports modern mounting methods, making it easier to incorporate into advanced electronic designs.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, ensuring reliability in environments with heat exposure.

Minimum Operating Temperature: -40 °C

Designed for harsh conditions, providing consistent performance in extreme cold environments.

Terminal Position: QUAD

Allows for efficient routing of signals and minimizes crosstalk among terminals in circuit board layouts.

Temperature Grade: INDUSTRIAL

Engineered to withstand industrial conditions, making it a reliable choice for demanding applications.

Maximum Analog Input Voltage: 2 V

Enables compatibility with low voltage analog signals, which is common in many modern devices.

Terminal Form: NO LEAD

Reduces the overall footprint on the PCB, making it more suitable for small form factor designs.

Converter Type: A/D CONVERTER

Transform analog signals into digital data, essential for digital processing and signal analysis.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Offers flexibility in digital signal representation, supporting various applications and standards.

Terminal Pitch: 0.635 mm

Fine pitch facilitates compact designs, allowing for a higher density of components on the PCB.

Technical Specifications

Analog-to-Digital Converters ADC1613S105HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.0076 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC32,.27SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

Trade Compliance

ADC1613S105HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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