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ADC1613S080HN/C1,5

NXP Semiconductors

ADC1613S080HN/C1,5 by NXP Semiconductors

ADC1613S080HN/C1,5 from NXP is a 16-bit A/D converter with a max linearity error of just 0.0076%. It operates b/w -40 °C to 85 °C and supports power supplies of 1.8V and 3V. Ideal for industrial applications, it features a compact chip carrier design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,420 parts In-Stock

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7,420

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Anansix

USA . 1,285 parts In-Stock

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1,285

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Digiode

USA . 56 parts In-Stock

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56

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Distributors (Availability)

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Andel Nordic

Denmark . 597 parts In-Stock

1+ parts

$7.861

100+ parts

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1k+ parts

$7.547

10k+ parts

$7.547

597

$7.861

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$7.547

$7.547

One Stop Electronics

USA . 348 parts In-Stock

1+ parts

$8.000

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348

$8.000

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Native Components

USA . 55 parts In-Stock

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$10.518

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55

$10.518

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Northwest PG Solutions

USA . 598 parts In-Stock

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$11.570

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$10.413

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598

$11.570

$10.413

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AZTECH Wire

Italy . 1,061 parts In-Stock

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$16.120

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1,061

$16.120

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Corphita

USA . 3,970 parts In-Stock

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3,970

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Microchip USA

USA . 3,687 parts In-Stock

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3,687

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UNI Independent Distributors

Spain . 2,339 parts In-Stock

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2,339

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Overview

Unlock the power of precision with the ADC1613S080HN/C1,5 from NXP Semiconductors—a leader in innovative solutions. This cutting-edge analog-to-digital converter boasts exceptional accuracy and reliability, ensuring your applications—from industrial automation to data acquisition—perform seamlessly in challenging environments. With its compact design and robust temperature range, it delivers unmatched performance while maximizing efficiency, giving you the competitive edge you need to succeed. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures a robust and reliable package, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern electronic assemblies.

Package Shape: SQUARE

The square package shape aids in efficient use of PCB space and enhances thermal performance.

No. of Bits: 16

With 16 bits, this ADC offers high resolution, making it ideal for precise measurements and high-quality signal conversion.

Maximum Linearity Error (EL): 0.0076 %

A low maximum linearity error ensures accurate and consistent performance across a wide range of input voltages.

Power Supplies (V): 1.8, 3

Dual voltage supply options (1.8V and 3V) provide flexibility for a variety of applications and designs.

No. of Terminals: 32

The 32 terminals ensure ample connections for input and output, enhancing the versatility of integration in complex circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for efficient heat dissipation and is suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

The high temperature range makes this ADC suitable for industrial applications subjected to elevated thermal conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliability and functionality in harsh environmental conditions.

Terminal Position: QUAD

Quad terminal positioning optimizes layout for connections, facilitating easier routing on PCBs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade use, this ADC provides durability and long-term reliability in demanding settings.

Maximum Analog Input Voltage: 2 V

The 2V maximum analog input voltage allows for compatibility with low-voltage signal sources, suitable for a variety of sensors and systems.

Terminal Form: NO LEAD

No lead configuration minimizes PCB space usage and simplifies assembly while reducing environmental impact.

Converter Type: A/D CONVERTER

As an A/D converter, it effectively bridges the gap between analog signals and digital systems, making it critical for data acquisition applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output bit code formats provide flexibility and ensure compatibility with various digital systems and processing needs.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch supports modern assembly techniques and high-density designs, maximizing space efficiency.

Technical Specifications

Analog-to-Digital Converters ADC1613S080HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.0076 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC32,.27SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

Trade Compliance

ADC1613S080HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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