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ADC1613D105HN/C1,5

NXP Semiconductors

ADC1613D105HN/C1,5 by NXP Semiconductors

ADC1613D105HN/C1,5 from NXP is a 16-bit A/D converter with a max linearity error of just 0.0076%. It operates b/w -40 °C to 85 °C and supports power supplies of 1.8V and 3V. Ideal for industrial applications, it features a compact chip carrier design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,364 parts In-Stock

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12,364

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Digiode

USA . 4,906 parts In-Stock

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Anansix

USA . 842 parts In-Stock

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842

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Native Components

USA . 382 parts In-Stock

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$1.510

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382

$1.510

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Northwest PG Solutions

USA . 931 parts In-Stock

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$1.661

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931

$1.661

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AZTECH Wire

Italy . 1,034 parts In-Stock

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$14.350

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One Stop Electronics

USA . 845 parts In-Stock

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$25.000

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845

$25.000

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UNI Independent Distributors

Spain . 4,320 parts In-Stock

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4,320

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Corphita

USA . 3,717 parts In-Stock

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Microchip USA

USA . 3,647 parts In-Stock

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Overview

Unlock precision and reliability with the ADC1613D105HN/C1,5 from NXP Semiconductors. Designed for demanding industrial applications, this advanced 16-bit Analog-to-Digital Converter ensures exceptional performance and accuracy, delivering unmatched value in data acquisition. With a robust temperature range and surface mount efficiency, it seamlessly integrates into your projects, empowering innovations in automation, control systems, and instrumentation. Experience the NXP difference—where quality meets cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures a lightweight yet durable design, contributing to the overall reliability and longevity of the product.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making it ideal for modern electronic applications.

No. of Functions: 2

Having two functions increases the versatility of the device, allowing it to handle multiple tasks within a single component, thus reducing complexity in design.

Package Shape: SQUARE

The square package shape facilitates easier placement on PCBs and can contribute to improved thermal performance.

No. of Bits: 16

A 16-bit resolution provides a high level of precision in analog-to-digital conversion, making it suitable for applications that require accurate measurement.

Maximum Linearity Error (EL): 0.0076%

This low maximum linearity error guarantees accurate representation of the input signal, making it a reliable choice for critical applications.

Power Supplies (V): 1.8, 3

Compatible with multiple supply voltages, this ADC can be easily integrated into various systems, enhancing its adaptability in diverse applications.

No. of Terminals: 56

A higher number of terminals allows for greater versatility in connectivity options, accommodating various design requirements and enhancing usability.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging is ideal for high-density applications, allowing for efficient space utilization on PCBs while ensuring reliable electrical performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for harsh environments, ensuring it can function effectively in a wide range of applications.

Minimum Operating Temperature: -40 °C

The capability to operate in low temperatures makes this ADC appropriate for outdoor and extreme conditions, ensuring reliable performance in various settings.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring robust connections and long-term reliability.

Terminal Position: QUAD

Quad terminal positioning enhances the ease of integration into circuit designs, improving layout efficiency and reducing potential signal interference.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this product is engineered for durability and reliability in challenging environments, making it a dependable option for industrial applications.

Maximum Analog Input Voltage: 3.4 V

Supporting a maximum input voltage of 3.4 V enables this ADC to handle a wide variety of signal types without risk of damage or distortion.

Terminal Form: NO LEAD

No lead design minimizes the risk of lead-related soldering issues, improves environmental compatibility, and contributes to overall design efficiency.

Converter Type: A/D CONVERTER

As an analog-to-digital converter, this device provides essential conversion capabilities necessary for interfacing analog signals with digital systems.

Output Bit Code: OFFSET BINARY

Offset binary output coding allows for straightforward processing in digital systems, enhancing compatibility with various digital signal processors.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch offers a compact design, facilitating higher density arrangements on PCBs and supporting modern, space-constrained applications.

Technical Specifications

Analog-to-Digital Converters ADC1613D105HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.0076 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1613D105HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.5

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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