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ADC1613D080HN/C1,5

NXP Semiconductors

ADC1613D080HN/C1,5 by NXP Semiconductors

ADC1613D080HN/C1,5 from NXP is a 16-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.0076% and operates within -40 °C to 85 °C. This surface-mount device supports dual functions with a compact chip carrier design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,001 parts In-Stock

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Vyrian

USA . 3,611 parts In-Stock

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Anansix

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Native Components

USA . 309 parts In-Stock

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$1.233

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Northwest PG Solutions

USA . 343 parts In-Stock

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$1.356

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AZTECH Wire

Italy . 897 parts In-Stock

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One Stop Electronics

USA . 603 parts In-Stock

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Component Stockers USA

USA . 730 parts In-Stock

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$99.990

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UNI Independent Distributors

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Microchip USA

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Corphita

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Overview

Unlock precision and reliability with the ADC1613D080HN/C1,5 from NXP Semiconductors. Engineered for exceptional performance in demanding conditions, this 16-bit analog-to-digital converter excels in industrial applications, ensuring your systems operate flawlessly even in extreme temperatures. Trust in NXP's renowned quality to enhance your designs, providing seamless integration and superior accuracy that translates to tangible benefits for your projects. Elevate your technology with ADC1613D080HN/C1,5!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

The surface mount technology allows for efficient use of space on PCBs, enabling compact designs that are ideal for modern electronic devices.

No. of Functions: 2

Having multiple functions in a single device increases versatility and can reduce the overall number of components required, lowering costs and complexity.

Package Shape: SQUARE

A square package shape often aids in uniform thermal distribution and can simplify layout on printed circuit boards.

No. of Bits: 16

A 16-bit resolution provides a good balance between precision and performance, making it suitable for high-quality data acquisition applications.

Maximum Linearity Error (EL): 0.0076%

With a very low maximum linearity error, this converter ensures high accuracy in signal conversion, which is critical for sensitive applications.

Power Supplies (V): 1.8, 3

Support for dual supply voltages allows greater flexibility in system design and compatibility with various power sources.

No. of Terminals: 56

A higher number of terminals enables more input/output options, enhancing the functionality and integration in complex systems.

Package Style (Meter): CHIP CARRIER

Chip carrier packages facilitate heat dissipation and robust connections, making them ideal for industrial applications.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature ensures reliable performance in a wide range of demanding environments.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature allows the product to function reliably in extreme cold conditions, making it suitable for diverse applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and reduces the risk of tin whiskering, enhancing long-term reliability.

Terminal Position: QUAD

Quad terminal positioning can streamline connections and simplify PCB layout, contributing to better manufacturing efficiency.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness and suitability for use in harsh environments, enhancing product longevity.

Maximum Analog Input Voltage: 3.4 V

Support for a maximum analog input voltage of 3.4 V allows for a wide range of input signals, making it adaptable to various applications.

Terminal Form: NO LEAD

No-lead terminal form reduces the footprint on PCBs and improves thermal performance, making installation simpler in compact designs.

Converter Type: A/D CONVERTER

As an Analog-to-Digital Converter, it is suitable for digital applications, allowing for efficient signal processing and data analysis.

Output Bit Code: OFFSET BINARY

Using offset binary for output coding facilitates compatibility with digital systems and simplifies data interpretation.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density layouts, making this product ideal for modern miniaturized electronic designs.

Technical Specifications

Analog-to-Digital Converters ADC1613D080HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.0076 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1613D080HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.5

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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