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ADC1613D065HN/C1,5

NXP Semiconductors

ADC1613D065HN/C1,5 by NXP Semiconductors

ADC1613D065HN/C1,5 by NXP is a 16-bit A/D converter with a max linearity error of just 0.0076%. It operates within -40 °C to 85 °C and supports power supplies of 1.8V and 3V. Ideal for industrial applications requiring precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,282 parts In-Stock

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Digiode

USA . 1,682 parts In-Stock

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Anansix

USA . 771 parts In-Stock

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AZTECH Wire

Italy . 338 parts In-Stock

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$10.330

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One Stop Electronics

USA . 1,037 parts In-Stock

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$30.000

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Component Stockers USA

USA . 428 parts In-Stock

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$99.990

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428

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QUARKTWIN TECHNOLOGY LTD

USA . 15,465 parts In-Stock

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Microchip USA

USA . 12,857 parts In-Stock

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UNI Independent Distributors

Spain . 6,062 parts In-Stock

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Corphita

USA . 3,896 parts In-Stock

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Northwest PG Solutions

USA . 271 parts In-Stock

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Native Components

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Overview

Unlock precision and reliability with the ADC1613D065HN/C1,5 from NXP Semiconductors. This advanced analog-to-digital converter is engineered for industrial applications, delivering exceptional performance in challenging environments. With its robust design and unparalleled accuracy, it ensures seamless integration into your systems. Trust NXP's legacy of innovation to enhance your projects, reduce time-to-market, and elevate operational efficiency—empowering your success in a competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection, making the device suitable for a range of industrial applications.

Surface Mount: YES

Being surface mount compatible allows for easier and more compact PCB designs, enhancing overall device integration.

No. of Functions: 2

Multiple functions provide versatility, allowing this ADC to handle different tasks and reducing the need for additional components.

Package Shape: SQUARE

The square package shape facilitates efficient use of PCB space, enabling a more streamlined design and potentially lowering manufacturing costs.

No. of Bits: 16

A 16-bit resolution provides high accuracy and precision in signal conversion, making it suitable for applications requiring detailed data.

Maximum Linearity Error (EL): 0.0076%

Low maximum linearity error ensures reliable performance, crucial for applications where precision is paramount.

Power Supplies (V): 1.8, 3

Supports two different supply voltages, making it adaptable to various system requirements and contributing to energy efficiency.

No. of Terminals: 56

A higher number of terminals allows for enhanced connectivity and flexibility in application designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style supports optimal thermal management and performance, especially in compact electronics.

Maximum Operating Temperature: 85 °C

Operating at higher temperatures is critical for industrial applications, ensuring reliability in challenging environments.

Minimum Operating Temperature: -40 °C

Ability to function in extreme cold prevents failure in outdoor or harsh conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces the risk of oxidation, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout options, making it easier to integrate into designs.

Temperature Grade: INDUSTRIAL

Industrial-grade quality ensures robustness and reliability for long-term operations in demanding applications.

Maximum Analog Input Voltage: 3.4 V

High input voltage tolerance enables compatibility with various signal types, expanding usability in different applications.

Terminal Form: NO LEAD

No-lead design contributes to smaller form factors and better performance in high-frequency applications.

Converter Type: A/D CONVERTER

As an A/D converter, it directly transforms analog signals into digital values, essential for modern electronic systems.

Output Bit Code: OFFSET BINARY

Offset binary output simplifies interfacing with digital systems, facilitating easier integration.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for densely packed designs, which is advantageous in high-performance electronics.

Technical Specifications

Analog-to-Digital Converters ADC1613D065HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.0076 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1613D065HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.5

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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