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ADC1413S080HN/C1,5

NXP Semiconductors

ADC1413S080HN/C1,5 by NXP Semiconductors

ADC1413S080HN/C1,5 from NXP is a 14-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03% and operates within -40 °C to 85 °C, powered by 1.8V or 3V supplies. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,211 parts In-Stock

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3,211

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Digiode

USA . 2,370 parts In-Stock

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2,370

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Anansix

USA . 85 parts In-Stock

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85

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One Stop Electronics

USA . 277 parts In-Stock

1+ parts

$14.000

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277

$14.000

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AZTECH Wire

Italy . 611 parts In-Stock

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$17.150

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611

$17.150

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Native Components

USA . 246 parts In-Stock

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$625.950

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$613.431

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$607.172

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$600.912

246

$625.950

$613.431

$607.172

$600.912

Northwest PG Solutions

USA . 1,988 parts In-Stock

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$688.545

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UNI Independent Distributors

Spain . 4,917 parts In-Stock

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4,917

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Microchip USA

USA . 2,473 parts In-Stock

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Corphita

USA . 996 parts In-Stock

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996

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Overview

Unlock precision with the ADC1413S080HN/C1,5 from NXP Semiconductors, where top-tier quality meets exceptional performance. Designed for a range of applications in industrial automation and sensor interfaces, this 14-bit analog-to-digital converter ensures accurate data conversion even in demanding environments. With its robust temperature resilience and compact design, you gain reliability and efficiency, empowering your innovations to thrive in every project. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and protects the components, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic systems.

Package Shape: SQUARE

The square package shape facilitates efficient PCB layout and optimizes space utilization.

No. of Bits: 14

With 14 bits of resolution, this ADC delivers high precision and accuracy in digital representation of analog signals.

Maximum Linearity Error (EL): 0.03%

A low maximum linearity error ensures high fidelity in signal conversion, making this ADC suitable for demanding applications.

Power Supplies (V): 1.8, 3

Support for dual power supply voltages allows for versatile use in different electronic designs with varying power requirements.

No. of Terminals: 32

The high number of terminals provides ample connectivity options for extensive interfacing capabilities.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging ensures robust electrical connections and aids in heat dissipation, enhancing performance reliability.

Maximum Operating Temperature: 85 °C

The ability to operate in high temperatures makes this ADC suitable for industrial applications where thermal stability is crucial.

Minimum Operating Temperature: -40 °C

A wide operating temperature range enables the ADC to function in extreme environmental conditions, enhancing its versatility.

Terminal Position: QUAD

Quad terminal positioning simplifies connections and improves layout flexibility on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability and performance in harsh operating conditions, ideal for industrial applications.

Maximum Analog Input Voltage: 2V

The ADC is capable of handling a maximum input voltage of 2V, making it suitable for a variety of low-voltage signal applications.

Terminal Form: NO LEAD

No lead form reduces the product's footprint and enhances assembly efficiency on modern PCBs.

Converter Type: A/D CONVERTER

As an A/D converter, it is designed specifically for converting analog signals into digital format, meeting essential needs in signal processing.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output coding formats provide flexibility for integration with different digital systems and applications.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for high-density PCB designs, saving space while maintaining reliable connections.

Technical Specifications

Analog-to-Digital Converters ADC1413S080HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC32,.27SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

Trade Compliance

ADC1413S080HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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