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ADC1413D080HN/C1,5

NXP Semiconductors

ADC1413D080HN/C1,5 by NXP Semiconductors

ADC1413D080HN/C1,5 from NXP is a 14-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03%, operates b/w -40 °C to 85 °C, and supports dual functions in a compact chip carrier package. Perfect for precision data acquisition tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,775 parts In-Stock

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Anansix

USA . 2,899 parts In-Stock

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Digiode

USA . 2,220 parts In-Stock

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2,220

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Native Components

USA . 617 parts In-Stock

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$8.352

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617

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Northwest PG Solutions

USA . 492 parts In-Stock

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$9.188

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$8.269

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492

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$8.269

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AZTECH Wire

Italy . 369 parts In-Stock

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$14.530

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369

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One Stop Electronics

USA . 664 parts In-Stock

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$18.000

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Microchip USA

USA . 9,211 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,366 parts In-Stock

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Corphita

USA . 1,155 parts In-Stock

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UNI Independent Distributors

Spain . 1,124 parts In-Stock

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Overview

Elevate your projects with the ADC1413D080HN/C1,5 from NXP Semiconductors, a leader in analog-to-digital technology. Designed for impeccable accuracy and reliability, this 14-bit converter delivers superior performance in industrial applications under diverse conditions. With its compact, surface-mount design, it ensures easy integration while minimizing space. Trust in NXP's commitment to quality and innovation to enhance your systems and unlock new capabilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures the ADC can withstand environmental stress, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating easy integration into smaller electronic devices.

No. of Functions: 2

Having dual functionality enhances versatility, allowing for multiple applications in a single chip.

Package Shape: SQUARE

The square shape optimizes space on the PCB, promoting efficient layout and design.

No. of Bits: 14

With 14 bits of resolution, this ADC offers high precision, making it ideal for applications requiring accurate data conversion.

Maximum Linearity Error (EL): 0.03%

A low linearity error ensures accurate and reliable performance, crucial for demanding analog signal processing.

Power Supplies (V): 1.8, 3

Compatible with two supply voltages increases flexibility and simplifies power design in various systems.

No. of Terminals: 56

A higher number of terminals supports more connections, enhancing functionality and ease of integration in complex designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for efficient thermal management and signal integrity, crucial for high-performance applications.

Maximum Operating Temperature: 85 °C

Operating at higher temperatures makes the ADC suitable for industrial environments where conditions may be less than ideal.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold ensures reliability in outdoor and extreme condition applications.

Terminal Position: QUAD

Quad terminal positioning maximizes space efficiency and improves routing flexibility on printed circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability and performance in harsh environments, ideal for industrial applications.

Maximum Analog Input Voltage: 3.4 V

The capacity to handle up to 3.4 V for analog inputs allows this ADC to work with a wide range of sensor outputs.

Terminal Form: NO LEAD

No lead design reduces PCB footprint and helps in achieving a more compact device design.

Converter Type: A/D CONVERTER

As an Analog-to-Digital Converter, it is essential for converting real-world analog signals into digital data for processing.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output formats provide flexibility in interfacing with various digital systems, enhancing compatibility.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for compact design and higher terminal density, essential for modern electronic applications.

Technical Specifications

Analog-to-Digital Converters ADC1413D080HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

Trade Compliance

ADC1413D080HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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