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ADC1413D065HN/C1,5

NXP Semiconductors

ADC1413D065HN/C1,5 by NXP Semiconductors

ADC1413D065HN/C1,5 by NXP is a 14-bit A/D converter with a max linearity error of 0.03% and operates b/w -40 °C to 85 °C. It features a compact chip carrier package with 56 terminals for efficient surface mounting. Ideal for industrial applications requiring precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,296 parts In-Stock

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Vyrian

USA . 3,298 parts In-Stock

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Anansix

USA . 2,781 parts In-Stock

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One Stop Electronics

USA . 1,287 parts In-Stock

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$2.000

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Native Components

USA . 698 parts In-Stock

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$7.490

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AZTECH Wire

Italy . 707 parts In-Stock

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$10.060

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Ampacity Inc.

Singapore . 1,002 parts In-Stock

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Component Stockers USA

USA . 678 parts In-Stock

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$99.990

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Microchip USA

USA . 5,215 parts In-Stock

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Corphita

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UNI Independent Distributors

Spain . 2,605 parts In-Stock

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Northwest PG Solutions

USA . 1,449 parts In-Stock

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Overview

Unlock precision and performance with the ADC1413D065HN/C1,5 from NXP Semiconductors. Designed for resilience in industrial applications, this 14-bit analog-to-digital converter delivers unmatched accuracy with a maximum linearity error of just 0.03%. With its robust construction and wide temperature range, it’s perfect for demanding environments. Trust in NXP’s legacy of quality to elevate your projects, streamline your designs, and achieve superior results effortlessly!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronics, enhancing design flexibility.

No. of Functions: 2

Offering two functions enables increased versatility in applications, allowing designers to save board space and reduce component count.

Package Shape: SQUARE

The square package design can facilitate easier PCB layout and better thermal performance, making it suitable for high-density applications.

No. of Bits: 14

A 14-bit resolution provides high precision and accuracy in signal conversion, making this ADC suitable for demanding applications.

Maximum Linearity Error (EL): 0.03%

A low maximum linearity error ensures high fidelity in conversion, making it suitable for applications requiring precise measurements.

Power Supplies (V): 1.8, 3

This flexibility in power supply voltage allows for usage in a variety of systems, supporting both low-power and higher voltage applications.

No. of Terminals: 56

A higher number of terminals allows for more input/output connections, enhancing the product's functionality and integration capabilities.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for better thermal management and reliability in high-performance environments.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can operate in a variety of environments without performance degradation.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures (-40 °C) makes this ADC suitable for industrial and outdoor applications.

Terminal Position: QUAD

Quadrant terminal positioning optimizes layout for multilayer boards, aiding in more efficient signal routing.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robust performance in harsh conditions, making it ideal for industrial equipment.

Maximum Analog Input Voltage: 3.4 V

This maximum input voltage is suitable for interfacing with a wide range of sensors and other devices, enhancing versatility.

Terminal Form: NO LEAD

No lead design minimizes space requirements and reduces the risk of physical damage, improving reliability in compact spaces.

Converter Type: A/D CONVERTER

As an A/D converter, it facilitates the digitization of analog signals, bridging the gap between the analog world and digital processing.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output formats provide flexibility for different applications and compatibility with various digital systems.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density packaging, making this device suitable for modern compact electronic designs.

Technical Specifications

Analog-to-Digital Converters ADC1413D065HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

Trade Compliance

ADC1413D065HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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