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ADC1215S105HN/C1,5

NXP Semiconductors

ADC1215S105HN/C1,5 by NXP Semiconductors

ADC1215S105HN/C1,5 from NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03% and operates within -40 °C to 85 °C, powered by 3.5V supplies. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,920 parts In-Stock

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8,920

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Digiode

USA . 4,418 parts In-Stock

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4,418

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Anansix

USA . 2,141 parts In-Stock

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2,141

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Distributors (Availability)

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AZTECH Wire

Italy . 198 parts In-Stock

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$12.270

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198

$12.270

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One Stop Electronics

USA . 1,274 parts In-Stock

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$16.000

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1,274

$16.000

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Advanced Electronics

New Zealand . 25 parts In-Stock

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$24.563

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$22.352

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$20.142

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25

$24.563

$22.352

$20.142

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Component Stockers USA

USA . 586 parts In-Stock

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$99.990

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586

$99.990

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Corphita

USA . 3,855 parts In-Stock

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3,855

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Microchip USA

USA . 3,769 parts In-Stock

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Northwest PG Solutions

USA . 1,596 parts In-Stock

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$3.469

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1,596

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$3.469

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UNI Independent Distributors

Spain . 1,473 parts In-Stock

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1,473

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Native Components

USA . 957 parts In-Stock

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$3.434

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957

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$3.434

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Overview

Unlock unparalleled performance with the ADC1215S105HN/C1,5 from NXP Semiconductors—your trusted partner in innovation. This 12-bit analog-to-digital converter delivers exceptional accuracy and reliability for a range of industrial applications. With robust temperature resilience and an efficient design, it ensures superior data integrity while simplifying your development process. Experience the cutting-edge quality you expect from NXP and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, this material ensures reliable performance and longevity in various applications.

Surface Mount: YES

Support for surface mount technology allows for more compact designs and easier integration on PCBs.

Package Shape: SQUARE

The square package shape offers efficient space utilization on the circuit board, enhancing layout flexibility.

No. of Bits: 12

A 12-bit resolution provides a good balance between precision and complexity, suitable for a wide range of applications.

Maximum Linearity Error (EL): 0.03 %

A low maximum linearity error ensures high precision in signal conversion, making it ideal for sensitive applications.

Power Supplies (V): 3,5

Flexible power supply requirements allow for versatile use in various power environments, enhancing adaptability.

No. of Terminals: 40

A higher number of terminals provides additional connectivity options, facilitating integration into complex systems.

Package Style (Meter): CHIP CARRIER

Chip carrier design is suitable for high-density applications, enabling efficient use of board space.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Withstand extreme cold, ensuring reliability in harsh environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces the risk of whisker growth, ensuring stable connections.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing in tight spaces, improving design efficiency.

Temperature Grade: INDUSTRIAL

Designed for industrial standards, ensuring durability and reliability under challenging conditions.

Maximum Analog Input Voltage: 2 V

Supports signals up to 2 V, making it suitable for a wide range of analog signal applications.

Terminal Form: NO LEAD

No-lead design enhances compatibility with modern PCB technologies, simplifying assembly processes.

Converter Type: A/D CONVERTER

Effective analog-to-digital conversion makes it ideal for applications requiring digital signal processing.

Output Bit Code: OFFSET BINARY

Supports offset binary coding, providing easier integration with most digital systems and enhancing usability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density designs, suitable for space-constrained applications.

Technical Specifications

Analog-to-Digital Converters ADC1215S105HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3,5 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1215S105HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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