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ADC1213S125HN/C1,5

NXP Semiconductors

ADC1213S125HN/C1,5 by NXP Semiconductors

ADC1213S125HN/C1,5 from NXP is a 12-bit A/D converter ideal for industrial applications. It operates b/w -40 °C to 85 °C with a max linearity error of 0.12% and supports power supplies of 1.8V and 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,411 parts In-Stock

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Digiode

USA . 4,341 parts In-Stock

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Anansix

USA . 790 parts In-Stock

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790

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AZTECH Wire

Italy . 575 parts In-Stock

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$11.740

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575

$11.740

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Corohmni

South Africa . 15 parts In-Stock

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$19.879

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15

$19.879

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One Stop Electronics

USA . 683 parts In-Stock

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$34.000

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683

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Native Components

USA . 466 parts In-Stock

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$96.999

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$93.119

466

$96.999

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$93.119

Northwest PG Solutions

USA . 191 parts In-Stock

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$106.699

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191

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QUARKTWIN TECHNOLOGY LTD

USA . 26,146 parts In-Stock

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UNI Independent Distributors

Spain . 7,631 parts In-Stock

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Microchip USA

USA . 2,757 parts In-Stock

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Corphita

USA . 2,481 parts In-Stock

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Overview

Unlock precision at its finest with the ADC1213S125HN/C1,5 from NXP Semiconductors. Renowned for unmatched quality and reliability, this 12-bit analog-to-digital converter excels in a wide array of applications, from industrial automation to consumer electronics. Its robust design ensures exceptional accuracy and stability across extreme temperatures, empowering your projects with advanced performance and efficiency. Elevate your innovations with a trusted partner in technology—NXP delivers excellence you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material provides protection against environmental factors, ensuring longevity and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and placements on PCBs, making it ideal for space-constrained applications.

Package Shape: SQUARE

The square package shape optimizes space usage on the circuit board and facilitates easy alignment with other components.

No. of Bits: 12

With 12 bits of resolution, this ADC offers high precision and accuracy for a wide range of signal processing applications.

Maximum Linearity Error (EL): 0.12%

A low maximum linearity error ensures better performance and signal fidelity, making it suitable for high-accuracy applications.

Power Supplies (V): 1.8, 3

Dual power supply options provide flexibility for integration into different systems or power environments, enhancing compatibility.

No. of Terminals: 32

A higher number of terminals can accommodate more connections, allowing for versatile interfacing with various components.

Package Style (Meter): CHIP CARRIER

The chip carrier style provides excellent thermal and electrical performance, making it reliable for industrial-grade applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature rating enables usage in demanding environments, enhancing the product's reliability in industrial settings.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in extreme conditions, making it suitable for harsh environments.

Terminal Position: QUAD

Quad terminal positioning aids in better layout options on PCBs, contributing to improved performance and easier design integration.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade reliability, this ADC is suitable for applications requiring stringent performance and environmental durability.

Maximum Analog Input Voltage: 2 V

This spec allows for safe interfacing with various sensors and signals, enhancing the product's utility across diverse applications.

Terminal Form: NO LEAD

Lead-free terminals support environmentally friendly designs and simplify compliance with international standards for electronic components.

Converter Type: A/D CONVERTER

As an A/D converter, it enables the conversion of analog signals to digital, essential for modern digital signal processing applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output code formats provide flexibility for different applications and system requirements, enhancing overall versatility.

Terminal Pitch: 0.635 mm

The compact terminal pitch allows for higher-density designs on PCBs, facilitating modern slim-line electronic devices.

Technical Specifications

Analog-to-Digital Converters ADC1213S125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.12 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC32,.27SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

Trade Compliance

ADC1213S125HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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