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ADC1213D125HN/C1,5

NXP Semiconductors

ADC1213D125HN/C1,5 by NXP Semiconductors

ADC1213D125HN/C1,5 by NXP is a 12-bit A/D converter with a max linearity error of 0.12% and operates b/w -40 °C to 85 °C. It features a compact chip carrier package with 56 terminals for efficient surface mounting. Ideal for industrial applications requiring precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,357 parts In-Stock

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6,357

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Digiode

USA . 1,831 parts In-Stock

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1,831

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Anansix

USA . 602 parts In-Stock

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602

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Northwest PG Solutions

USA . 1,644 parts In-Stock

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$3.388

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1,644

$3.388

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AZTECH Wire

Italy . 1,169 parts In-Stock

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$8.250

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$8.250

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$11.762

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$10.703

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$9.645

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350

$11.762

$10.703

$9.645

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One Stop Electronics

USA . 569 parts In-Stock

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$19.000

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569

$19.000

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UNI Independent Distributors

Spain . 2,628 parts In-Stock

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Microchip USA

USA . 940 parts In-Stock

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Corphita

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Native Components

USA . 785 parts In-Stock

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$2.988

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785

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Overview

Unlock unparalleled precision in your designs with the ADC1213D125HN/C1,5 from NXP Semiconductors! Renowned for their commitment to quality and innovation, NXP delivers this robust analog-to-digital converter, engineered for reliability across diverse industrial applications. Benefit from exceptional accuracy, low power consumption, and a compact design, all while enhancing your projects’ performance and efficiency. Elevate your technology with trusted expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern circuit boards, saving valuable space.

No. of Functions: 2

Having two functions in one device adds versatility and can simplify designs by reducing the number of required components.

Package Shape: SQUARE

The square package shape is conducive for efficient layout and stacking on PCBs, enhancing performance in space-constrained designs.

No. of Bits: 12

A 12-bit resolution provides high precision and accuracy in conversions, suitable for applications requiring detailed measurements.

Maximum Linearity Error (EL): 0.12 %

A low maximum linearity error ensures excellent performance and reliability, making it ideal for high-quality applications.

Power Supplies (V): 1.8, 3

Dual power supply options provide flexibility in design and enable compatibility with a wider range of systems.

No. of Terminals: 56

A higher number of terminals allows for more input/output connections, increasing the device's versatility in circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style facilitates efficient thermal management and electrical performance in compact applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this device suitable for industrial applications that may experience higher ambient conditions.

Minimum Operating Temperature: -40 °C

Its capability to function in extremely low temperatures ensures reliability in harsh environments, enhancing application versatility.

Terminal Position: QUAD

Quad terminal positioning allows for easier routing of signals on PCB, minimizing design complexity.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees performance and reliability in temperature-sensitive applications.

Maximum Analog Input Voltage: 3.4 V

A high maximum analog input voltage allows for a wider range of input signals, making it suitable for various application scenarios.

Terminal Form: NO LEAD

No lead design reduces the environmental impact and offers compatibility with modern lead-free soldering processes.

Converter Type: A/D CONVERTER

As an A/D converter, it bridges the analog and digital domains, making it essential for interfacing with digital systems.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

This flexibility in output formats allows for compatibility with various digital systems and simplifies data interpretation.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for high-density applications, allowing for more compact circuit designs without sacrificing performance.

Technical Specifications

Analog-to-Digital Converters ADC1213D125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.12 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

Trade Compliance

ADC1213D125HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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