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ADC1212D105HN/C1,5

NXP Semiconductors

ADC1212D105HN/C1,5 by NXP Semiconductors

ADC1212D105HN/C1,5 by NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.12% and operates within -40 °C to 85 °C. This surface-mount device supports dual functions with a nominal voltage of 3V.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,610 parts In-Stock

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Anansix

USA . 770 parts In-Stock

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Digiode

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Native Components

USA . 863 parts In-Stock

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$1.807

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Northwest PG Solutions

USA . 1,186 parts In-Stock

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$1.987

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Corohmni

South Africa . 32 parts In-Stock

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AZTECH Wire

Italy . 1,057 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$22.020

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$19.842

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One Stop Electronics

USA . 1,472 parts In-Stock

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$35.000

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Component Stockers USA

USA . 774 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 26,686 parts In-Stock

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UNI Independent Distributors

Spain . 4,598 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unlock precision with the ADC1212D105HN/C1,5 from NXP Semiconductors, where quality meets innovation. Designed for industrial applications, this advanced analog-to-digital converter delivers unmatched accuracy and reliability, ensuring your projects run smoothly in any environment. With a compact design and exceptional performance, it empowers engineers to create cutting-edge solutions that elevate efficiency and drive success. Choose NXP for unrivaled expertise and superior technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability while keeping the package lightweight, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enhances the device's compactness and is ideal for modern high-density circuit designs.

No. of Functions: 2

Having two functions allows for versatile applications, reducing the need for multiple separate devices.

Package Shape: SQUARE

The square shape facilitates efficient space utilization on circuit boards.

No. of Bits: 12

A 12-bit resolution provides a good balance between performance and complexity, making it suitable for many applications requiring decent precision.

Maximum Linearity Error (EL): 0.12 %

A low maximum linearity error ensures high accuracy in data conversion, essential for critical applications.

Power Supplies (V): 3

Operating at low voltage levels promotes energy efficiency and compatibility with battery-operated systems.

No. of Terminals: 64

A higher number of terminals provides more options for connectivity, enhancing the integration capabilities of the converter.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging supports better thermal performance and reliability in various environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding conditions typically found in industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in extreme conditions, making it suitable for harsh environments.

Terminal Position: QUAD

Quad terminal positioning enables efficient use of space and simplifies board layout design.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed to perform reliably in challenging conditions, ensuring long-term stability.

Maximum Analog Input Voltage: 3.4 V

A maximum input voltage of 3.4 V makes the converter versatile for various applications that operate within this range.

Terminal Form: NO LEAD

No lead design minimizes size and contributes to environmentally-friendly manufacturing practices.

Converter Type: A/D CONVERTER

As an A/D converter, this product bridges the gap between the analog and digital worlds, crucial for data acquisition systems.

Nominal Supply Voltage: 3 V

The nominal supply voltage aligns with low-power applications, enhancing the overall efficiency of the system.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Support for multiple output formats provides flexibility for integration into various digital systems.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for finer connections in compact designs, facilitating high-density board layouts.

Technical Specifications

Analog-to-Digital Converters ADC1212D105HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.12 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

3.4 V

Nominal Supply Voltage:

3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

Trade Compliance

ADC1212D105HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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