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ADC1212D080HN/C1,5

NXP Semiconductors

ADC1212D080HN/C1,5 by NXP Semiconductors

ADC1212D080HN/C1,5 from NXP is a 12-bit A/D converter with a max linearity error of 0.12% and operates b/w -40 °C to 85 °C. It features a compact chip carrier package with 64 terminals for efficient surface mounting. Ideal for industrial applications requiring precise analog-to-digital conversion at 3V supply.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,458 parts In-Stock

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Anansix

USA . 1,751 parts In-Stock

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Digiode

USA . 343 parts In-Stock

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Native Components

USA . 973 parts In-Stock

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$7.585

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AZTECH Wire

Italy . 549 parts In-Stock

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$8.240

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Corohmni

South Africa . 698 parts In-Stock

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One Stop Electronics

USA . 1,571 parts In-Stock

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Advanced Electronics

New Zealand . 58 parts In-Stock

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$28.003

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$25.483

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$22.962

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Component Stockers USA

USA . 670 parts In-Stock

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$99.990

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Microchip USA

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Corphita

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Northwest PG Solutions

USA . 1,243 parts In-Stock

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UNI Independent Distributors

Spain . 409 parts In-Stock

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Overview

Unlock unparalleled precision and reliability with the ADC1212D080HN/C1,5 from NXP Semiconductors, a leader in innovative solutions. This versatile analog-to-digital converter excels in demanding environments, delivering exceptional linearity and performance across various applications, from industrial automation to medical devices. Its compact design and robust temperature range ensure seamless integration, empowering your projects with unmatched quality and efficiency. Elevate your designs with NXP's trusted technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into modern electronic circuits.

No. of Functions: 2

Having two functions enhances versatility, allowing for multiple applications and reducing the need for additional components.

Package Shape: SQUARE

The square package shape facilitates efficient use of PCB space, which is essential in modern compact designs.

No. of Bits: 12

A 12-bit resolution enables high-precision data conversion, which is ideal for applications requiring detailed signal representation.

Maximum Linearity Error (EL): 0.12 %

A low maximum linearity error indicates high accuracy in data conversion, making this product suitable for precision demanding applications.

Power Supplies (V): 3

The requirement for a 3V power supply means lower power consumption, making it energy-efficient for battery-operated devices.

No. of Terminals: 64

With 64 terminals, the device offers ample connectivity options for various configurations, enhancing its flexibility in different applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style promotes improved thermal performance and ease of mounting, which is beneficial in industrial settings.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C allows the product to function reliably in various demanding environments without risk of failure.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C ensures that the device can be used in extreme conditions, making it suitable for industrial applications.

Terminal Position: QUAD

Quad terminal positions allow for efficient routing on PCBs, which aids in maintaining signal integrity and reducing interference.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness and reliability, ensuring performance in harsh industrial environments.

Maximum Analog Input Voltage: 3.4 V

A maximum input voltage of 3.4V allows for compatibility with a range of analog signals, making it suitable for various applications.

Terminal Form: NO LEAD

No lead terminals contribute to a smaller footprint and are environmentally friendly, meeting modern standards for reducing lead usage.

Converter Type: A/D CONVERTER

As an Analog-to-Digital converter, this product efficiently translates analog signals into digital format, essential for modern electronics.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V represents a lower operational voltage requirement, promoting energy efficiency in designs.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output bit coding schemes provide flexibility in interfacing with different digital systems, enhancing compatibility.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density PCB designs, facilitating the creation of compact electronic applications.

Technical Specifications

Analog-to-Digital Converters ADC1212D080HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.12 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

3.4 V

Nominal Supply Voltage:

3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

Trade Compliance

ADC1212D080HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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