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ADC1210S125HN/C1,5

NXP Semiconductors

ADC1210S125HN/C1,5 by NXP Semiconductors

ADC1210S125HN/C1,5 by NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03%, operates b/w -40 °C to 85 °C, and supports a nominal voltage of 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,806 parts In-Stock

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Anansix

USA . 1,157 parts In-Stock

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Digiode

USA . 1,074 parts In-Stock

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Native Components

USA . 852 parts In-Stock

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$0.185

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Northwest PG Solutions

USA . 1,905 parts In-Stock

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$0.204

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$0.179

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AZTECH Wire

Italy . 410 parts In-Stock

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$14.510

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Ampacity Inc.

Singapore . 384 parts In-Stock

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$18.000

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One Stop Electronics

USA . 423 parts In-Stock

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$26.000

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Microchip USA

USA . 2,001 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,637 parts In-Stock

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Corphita

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UNI Independent Distributors

Spain . 1,729 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled performance in your projects with the ADC1210S125HN/C1,5 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a reliable analog-to-digital converter that excels in diverse applications, from industrial automation to consumer electronics. Experience exceptional precision and low power consumption, ensuring your designs are both efficient and effective, while enjoying the peace of mind that comes with a trusted brand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for a more compact design and efficient use of PCB space, facilitating integration into smaller electronic devices.

Package Shape: SQUARE

The square package shape provides uniform dimensions, which can simplify board layout and assembly processes.

No. of Bits: 12

With 12 bits of resolution, this ADC offers a good balance between precision and performance, making it suitable for many applications that require accurate signal conversion.

Maximum Linearity Error (EL): 0.03%

A maximum linearity error of 0.03% ensures high accuracy in analog-to-digital conversion, which is crucial for applications demanding precision.

Power Supplies (V): 3

Operating at a low supply voltage of 3V makes this device energy-efficient, contributing to lower power consumption in battery-operated devices.

No. of Terminals: 40

Having 40 terminals allows for multiple connections, enabling greater flexibility in circuit design and integration into complex systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style ensures better heat dissipation and improved performance in thermal management.

Maximum Operating Temperature: 85 °C

The ability to operate up to 85 °C makes this ADC suitable for industrial applications where higher temperatures are encountered.

Minimum Operating Temperature: -40 °C

Operating as low as -40 °C ensures that this ADC can function reliably in extreme cold environments, expanding its usability.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and reduces oxidation, ensuring reliable connections and longevity of the device.

Terminal Position: QUAD

Quad terminal positioning facilitates easier access for connections and optimizes space for PCB layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates suitability for harsh environments and rigorous applications, ensuring reliable performance.

Maximum Analog Input Voltage: 2V

A maximum analog input voltage of 2V ensures compatibility with a wide range of sensor outputs, enhancing application versatility.

Technology: CMOS

Utilizing CMOS technology provides low power consumption while maintaining high performance, making it ideal for battery-powered applications.

Terminal Form: NO LEAD

No lead terminal form reduces footprint on PCBs and provides better performance characteristics compared to traditional leaded components.

Converter Type: A/D CONVERTER

As an A/D converter, this device is essential for converting analog signals into digital format, enabling integration with digital systems.

Nominal Supply Voltage: 3V

A nominal supply voltage of 3V aligns with modern low-power standards, making it suitable for energy-efficient designs.

Output Bit Code: OFFSET BINARY

Using offset binary output allows for better representation of negative and positive values, simplifying data processing in various applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables compactly packed terminals, which is ideal for high-density PCB designs.

Technical Specifications

Analog-to-Digital Converters ADC1210S125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1210S125HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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