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ADC1210S080HN/C1,5

NXP Semiconductors

ADC1210S080HN/C1,5 by NXP Semiconductors

ADC1210S080HN/C1,5 by NXP is a 12-bit A/D converter with a max linearity error of 0.03% and operates b/w -40 °C to 85 °C. It features a compact chip carrier package and requires a nominal voltage of 3V. Ideal for industrial applications needing precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,540 parts In-Stock

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Digiode

USA . 4,428 parts In-Stock

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Anansix

USA . 1,316 parts In-Stock

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Native Components

USA . 787 parts In-Stock

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$0.541

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Northwest PG Solutions

USA . 472 parts In-Stock

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$0.595

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Ampacity Inc.

Singapore . 1,110 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 465 parts In-Stock

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Corohmni

South Africa . 203 parts In-Stock

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One Stop Electronics

USA . 1,378 parts In-Stock

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Microchip USA

USA . 2,949 parts In-Stock

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UNI Independent Distributors

Spain . 7,456 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Unlock precision and reliability with the ADC1210S080HN/C1,5 from NXP Semiconductors. Renowned for their commitment to quality, NXP delivers a robust 12-bit analog-to-digital converter that excels in industrial applications. With exceptional linearity and wide operating temperatures, this versatile device ensures accurate data conversion, enhancing performance in demanding environments. Experience unmatched value and efficiency—choose NXP for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resilience against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and improved performance, ideal for space-constrained applications.

Package Shape: SQUARE

A square package shape facilitates easier integration into circuit boards and efficient use of space.

No. of Bits: 12

A 12-bit resolution offers high precision and excellent performance for applications requiring detailed and accurate data conversion.

Maximum Linearity Error (EL): 0.03 %

The low maximum linearity error ensures minimal distortion in readings, enhancing the accuracy of the converted signals.

Power Supplies (V): 3

Operating on a low voltage of 3V makes this converter energy-efficient and ideal for battery-operated devices.

No. of Terminals: 40

Having 40 terminals allows for robust connectivity options and versatility in design, supporting various configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier style ensures effective heat dissipation and is suitable for industrial environments.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows this product to function effectively in high-temperature applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for use in extreme environmental conditions.

Terminal Finish: MATTE TIN

A matte tin finish ensures good solderability and resistance to oxidation, enhancing the longevity of connections.

Terminal Position: QUAD

The quad terminal positioning provides improved layout and reduces potential interference, facilitating better performance.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature grading, this product guarantees reliability and stability in harsh environments.

Maximum Analog Input Voltage: 2 V

A maximum analog input voltage of 2V allows for interfacing with a wide range of sensors, offering flexibility in applications.

Technology: CMOS

Utilizing CMOS technology, this converter benefits from low power consumption and high-speed performance.

Terminal Form: NO LEAD

No-lead terminals reduce the environmental footprint and make the device suitable for modern assemblies that prioritize eco-friendliness.

Converter Type: A/D CONVERTER

As an Analog-to-Digital Converter, it effectively bridges analog signals to digital formats, essential for modern electronic systems.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V ensures compatibility with standard circuits, simplifying integration.

Output Bit Code: OFFSET BINARY

Outputting in offset binary format enhances compatibility with various digital systems and simplifies the processing of converted data.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density placements on circuit boards, maximizing the layout efficiency.

Technical Specifications

Analog-to-Digital Converters ADC1210S080HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1210S080HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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