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ADC1210S065HN/C1,5

NXP Semiconductors

ADC1210S065HN/C1,5 by NXP Semiconductors

ADC1210S065HN/C1,5 by NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03%, operates b/w -40 °C to 85 °C, and supports a nominal voltage of 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,070 parts In-Stock

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Anansix

USA . 2,332 parts In-Stock

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Digiode

USA . 2,223 parts In-Stock

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Microchip USA

USA . 3,193 parts In-Stock

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$1.000

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Native Components

USA . 816 parts In-Stock

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$8.250

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816

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Northwest PG Solutions

USA . 180 parts In-Stock

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$9.075

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$8.167

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180

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$8.167

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AZTECH Wire

Italy . 581 parts In-Stock

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$16.220

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581

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One Stop Electronics

USA . 520 parts In-Stock

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$20.000

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520

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Component Stockers USA

USA . 315 parts In-Stock

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$99.990

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UNI Independent Distributors

Spain . 7,739 parts In-Stock

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Corphita

USA . 4,899 parts In-Stock

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Overview

Unlock precision and reliability with the ADC1210S065HN/C1,5 from NXP Semiconductors. This advanced 12-bit analog-to-digital converter is designed for industrial applications where accuracy matters. With NXP's commitment to quality, you benefit from a product that ensures superior performance even in harsh environments. Experience seamless integration, low power consumption, and robust temperature tolerance, making it the ideal choice for your next innovative project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protects the internal components from environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Being a surface mount device enables efficient use of board space and simplifies the assembly process, making it ideal for compact designs.

Package Shape: SQUARE

The square package shape allows for symmetrical placement on PCB, enhancing stability and performance in tight spaces.

No. of Bits: 12

With 12 bits of resolution, this ADC provides high precision in converting analog signals to digital, suitable for applications requiring detailed signal analysis.

Maximum Linearity Error (EL): 0.03 %

A low maximum linearity error ensures accurate signal reproduction, making this ADC a good choice for critical measurement applications.

Power Supplies (V): 3

Operating at a low power supply voltage of 3V makes this ADC energy-efficient, suitable for battery-operated devices.

No. of Terminals: 40

With 40 terminals, this ADC provides ample connectivity options for integration into complex systems without sacrificing performance.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides ease of handling and assembly, ensuring reliable performance in manufacturing.

Maximum Operating Temperature: 85 °C

Designed to operate at a maximum temperature of 85 °C, this device can function reliably in moderately high-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this ADC is well-suited for industrial applications in extreme conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and reduces the risk of corrosion, ensuring long-lasting connections.

Terminal Position: QUAD

Quad terminal positioning provides efficient routing and layout options, optimizing performance in complex PCB designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robust performance and reliability in demanding environments, suitable for industrial applications.

Maximum Analog Input Voltage: 2 V

A maximum analog input voltage of 2V enhances safety in applications, ensuring compatibility with low-voltage sensor outputs.

Technology: CMOS

Using CMOS technology combines low power consumption with high-speed processing, making this ADC efficient for a range of applications.

Terminal Form: NO LEAD

The no-lead terminal form optimizes space utilization on PCBs while maintaining high reliability in electrical performance.

Converter Type: A/D CONVERTER

As an analog-to-digital converter, this device is essential for digitizing real-world signals, making it versatile for various applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V makes it adaptable for low-power applications, particularly in portable electronics.

Output Bit Code: OFFSET BINARY

Utilizing offset binary output simplifies interfacing with standard digital systems, enhancing compatibility and ease of use.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density placement on PCBs, making it suitable for compact electronic designs.

Technical Specifications

Analog-to-Digital Converters ADC1210S065HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1210S065HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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