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ADC1115S125HN/C1,5

NXP Semiconductors

ADC1115S125HN/C1,5 by NXP Semiconductors

ADC1115S125HN/C1,5 from NXP is an 11-bit A/D converter designed for industrial applications. It operates b/w -40 °C to 85 °C with a max analog input of 5.25V and supports both 3V and 5V power supplies. Its compact chip carrier package ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,053 parts In-Stock

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Anansix

USA . 2,809 parts In-Stock

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Digiode

USA . 1,771 parts In-Stock

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Native Components

USA . 25 parts In-Stock

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$5.020

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One Stop Electronics

USA . 1,627 parts In-Stock

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$15.000

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AZTECH Wire

Italy . 433 parts In-Stock

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$17.560

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Corohmni

South Africa . 404 parts In-Stock

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Component Stockers USA

USA . 27 parts In-Stock

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$24.430

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Ampacity Inc.

Singapore . 1,578 parts In-Stock

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$29.000

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QUARKTWIN TECHNOLOGY LTD

USA . 19,549 parts In-Stock

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UNI Independent Distributors

Spain . 8,246 parts In-Stock

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Microchip USA

USA . 6,903 parts In-Stock

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Corphita

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Northwest PG Solutions

USA . 174 parts In-Stock

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Perfect Parts

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Overview

Elevate your projects with the ADC1115S125HN/C1,5 from NXP Semiconductors—a trusted leader in high-quality electronic solutions. This robust Analog-to-Digital Converter is engineered for precision and reliability across various applications, from industrial automation to consumer electronics. With its compact design and exceptional performance, you’ll experience faster data acquisition and enhanced system efficiency, ensuring your designs stand out in a competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, enhancing the longevity of the product.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, making integration into modern electronics easier.

Package Shape: SQUARE

The square shape ensures easy placement on the PCB and optimizes the use of space in electronic assemblies.

No. of Bits: 11

An 11-bit resolution provides a good balance between performance and cost, enabling accurate representation of analog signals.

Power Supplies (V): 3/5

Supports multiple power supply options, allowing for flexibility in different applications and reducing the need for additional power management components.

No. of Terminals: 40

With 40 terminals, this ADC supports extensive connectivity options, accommodating a variety of input and output configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier style is suitable for high-density applications, making this product ideal for modern electronic circuits.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature ensures reliability and stability in diverse industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate in very low temperatures makes this ADC suitable for harsh environments, enhancing its application range.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring high-quality connections and durability.

Terminal Position: QUAD

Quad terminal positioning improves layout flexibility and supports better signal integrity in circuit designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial use means this ADC is designed to withstand harsh environmental conditions, making it ideal for critical applications.

Maximum Analog Input Voltage: 5.25 V

A maximum analog input voltage of 5.25 V allows for compatibility with a wide range of analog sensors and signals, enhancing its versatility.

Terminal Form: NO LEAD

No lead terminal form contributes to a smaller footprint and is environmentally friendly, aligning with modern manufacturing practices.

Converter Type: A/D CONVERTER

As an analog-to-digital converter, it enables the digitization of analog signals, making it essential for modern digital systems.

Output Bit Code: OFFSET BINARY

Using offset binary coding simplifies the digital processing of the output, making it easier to integrate into existing systems.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density layouts, which is critical in space-constrained designs.

Technical Specifications

Analog-to-Digital Converters ADC1115S125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

11

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Electrical Specifications

Power Supplies:

3/5 V

Maximum Analog Input Voltage:

5.25 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1115S125HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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