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ADC1113D125HN/C1,5

NXP Semiconductors

ADC1113D125HN/C1,5 by NXP Semiconductors

ADC1113D125HN/C1,5 by NXP is an 11-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.24% and operates b/w -40 °C to 85 °C with power supplies of 1.8V and 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 7,702 parts In-Stock

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Anansix

USA . 2,563 parts In-Stock

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Digiode

USA . 249 parts In-Stock

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Native Components

USA . 152 parts In-Stock

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$0.791

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Northwest PG Solutions

USA . 864 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 719 parts In-Stock

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Ampacity Inc.

Singapore . 1,218 parts In-Stock

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Component Stockers USA

USA . 758 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Corphita

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Overview

Unlock precision and reliability with the ADC1113D125HN/C1,5 from NXP Semiconductors. This cutting-edge analog-to-digital converter is designed to elevate your applications, delivering superior performance in diverse industrial environments. With its robust temperature range and low power consumption, you gain unmatched accuracy and efficiency, perfect for everything from data acquisition to sensor interfacing. Experience the trusted quality of NXP that empowers innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability of the device in various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint, making it suitable for compact designs.

No. of Functions: 2

Having multiple functions enhances versatility, allowing it to serve different roles in a circuit.

Package Shape: SQUARE

The square package shape facilitates efficient use of board space in electronic designs.

No. of Bits: 11

An 11-bit resolution provides a good balance between performance and complexity, making it suitable for various applications.

Maximum Linearity Error (EL): 0.24 %

A low maximum linearity error ensures accurate signal reproduction, which is critical for high-quality data acquisition.

Power Supplies (V): 1.8, 3

Supports dual supply voltage levels, offering flexibility for different system power requirements.

No. of Terminals: 56

The larger number of terminals allows for greater connectivity and integration options in complex applications.

Package Style (Meter): CHIP CARRIER

Chip carrier style enhances thermal performance and is suitable for high-density applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function efficiently in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold makes this device ideal for applications in harsh climates.

Terminal Finish: MATTE TIN

Matte tin plating improves solderability, ensuring reliable connections during assembly.

Terminal Position: QUAD

Quad terminal positioning allows for easier routing on PCBs, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range, ensuring reliability in critical applications.

Maximum Analog Input Voltage: 3.4 V

A maximum analog input voltage of 3.4V enables connection with a variety of sensor outputs.

Terminal Form: NO LEAD

No-lead design reduces space and improves soldering efficiency, making it suitable for automated assembly.

Converter Type: A/D CONVERTER

As an A/D converter, it transforms analog signals into digital form, vital for modern electronic systems.

Output Bit Code: OFFSET BINARY

Offset binary coding provides straightforward compatibility with various digital systems.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density layouts, maximizing PCB space utilization.

Technical Specifications

Analog-to-Digital Converters ADC1113D125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

11

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.24 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1113D125HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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