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ADC1112D125HN/C1,5

NXP Semiconductors

ADC1112D125HN/C1,5 by NXP Semiconductors

ADC1112D125HN/C1,5 by NXP is an 11-bit A/D converter with a max linearity error of 0.029% and operates within -40 °C to 85 °C. It features a compact chip carrier design with 64 terminals for efficient surface mounting. Ideal for industrial applications requiring precise analog-to-digital conversion at 3V supply.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,961 parts In-Stock

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Digiode

USA . 3,006 parts In-Stock

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3,006

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Anansix

USA . 996 parts In-Stock

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Native Components

USA . 841 parts In-Stock

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$0.469

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$0.450

841

$0.469

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$0.450

Northwest PG Solutions

USA . 389 parts In-Stock

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$0.516

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$0.455

389

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$0.455

One Stop Electronics

USA . 1,358 parts In-Stock

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$6.000

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1,358

$6.000

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AZTECH Wire

Italy . 320 parts In-Stock

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$17.060

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320

$17.060

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Component Stockers USA

USA . 398 parts In-Stock

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$99.990

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398

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QUARKTWIN TECHNOLOGY LTD

USA . 28,245 parts In-Stock

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Microchip USA

USA . 4,076 parts In-Stock

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Corphita

USA . 3,044 parts In-Stock

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UNI Independent Distributors

Spain . 490 parts In-Stock

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Overview

Experience unparalleled precision with the ADC1112D125HN/C1,5 from NXP Semiconductors—where cutting-edge technology meets robust reliability. Designed for demanding applications, this advanced analog-to-digital converter delivers exceptional performance in industrial environments, ensuring accurate data capture even under extreme conditions. With NXP's renowned quality and innovation backing it, you gain not just a component, but a trusted partner that enhances your designs and drives success. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy enhances the reliability and longevity of the product in various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and easier integration into modern electronic designs.

No. of Functions: 2

Having multiple functions in one device reduces board space and simplifies design, making it versatile for different applications.

Package Shape: SQUARE

The square package shape optimizes space utilization on printed circuit boards and is easier to handle during assembly.

No. of Bits: 11

An 11-bit resolution provides a good balance between performance and complexity, ideal for various industrial applications.

Maximum Linearity Error (EL): 0.029 %

A low maximum linearity error ensures high accuracy in signal conversion, making this ADC reliable for precise applications.

Power Supplies (V): 3

A low power supply requirement of 3V makes it suitable for battery-operated devices and energy-efficient applications.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options, facilitating easy integration into complex circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier style offers better thermal performance and reliability in high-density applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can perform reliably in demanding environments.

Minimum Operating Temperature: -40 °C

A wide temperature range allows for operation in extreme conditions, making it suitable for industrial and outdoor applications.

Terminal Position: QUAD

Quad terminal positioning optimizes space and enables easier routing on PCBs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, it ensures robustness and long-term stability in critical systems.

Maximum Analog Input Voltage: 2 V

A maximum analog input voltage of 2V suits low-voltage applications and enhances safety in sensitive environments.

Terminal Form: NO LEAD

No lead configuration minimizes the environmental footprint and improves soldering reliability, complying with modern manufacturing standards.

Converter Type: A/D CONVERTER

As an A/D converter, it provides essential functionality for converting analog signals to digital, key for digital data acquisition systems.

Nominal Supply Voltage: 3 V

The nominal supply voltage aligns with standard logic levels, ensuring compatibility with existing systems.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output formats allow for flexibility in applications, catering to various digital system requirements.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables high-density layouts, making it suitable for compact electronic devices.

Technical Specifications

Analog-to-Digital Converters ADC1112D125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

11

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.029 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

Trade Compliance

ADC1112D125HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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