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ADC1010S125HN/C1,5

NXP Semiconductors

ADC1010S125HN/C1,5 by NXP Semiconductors

ADC1010S125HN/C1,5 from NXP is a 10-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.039%, operates b/w -40 °C to 85 °C, and supports a nominal voltage of 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,218 parts In-Stock

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12,218

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Digiode

USA . 2,943 parts In-Stock

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2,943

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Anansix

USA . 2,825 parts In-Stock

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2,825

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Distributors (Availability)

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AZTECH Wire

Italy . 804 parts In-Stock

1+ parts

$20.990

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804

$20.990

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One Stop Electronics

USA . 1,005 parts In-Stock

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$22.000

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1,005

$22.000

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Component Stockers USA

USA . 253 parts In-Stock

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$99.990

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253

$99.990

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Corphita

USA . 4,830 parts In-Stock

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4,830

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UNI Independent Distributors

Spain . 4,631 parts In-Stock

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4,631

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Microchip USA

USA . 2,472 parts In-Stock

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2,472

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Northwest PG Solutions

USA . 2,260 parts In-Stock

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$3.303

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2,260

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$3.303

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Native Components

USA . 382 parts In-Stock

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$3.269

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382

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$3.269

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Overview

Elevate your designs with the ADC1010S125HN/C1,5 from NXP Semiconductors—your trusted partner in innovation. This advanced Analog-to-Digital Converter delivers exceptional performance with unmatched accuracy and reliability, perfect for industrial applications. With a compact design and robust temperature range, it ensures seamless integration and long-lasting operation. Choose NXP for superior quality and drive your projects towards success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliability and protection against environmental factors, making this product suitable for various applications.

Surface Mount: YES

The surface mount design allows for a compact layout and efficient use of PCB space, making it ideal for modern electronic devices.

Package Shape: SQUARE

The square package shape contributes to an efficient layout, supporting the compact design of electronic systems.

No. of Bits: 10

With 10 bits of resolution, this A/D converter offers a balance between performance and complexity, suitable for a range of applications.

Maximum Linearity Error (EL): 0.039 %

A low maximum linearity error ensures accurate conversions, making this product ideal for precision measurement applications.

Power Supplies (V): 3

The ability to operate at a low power supply voltage of 3 V makes it energy-efficient, aligning with modern power-saving technologies.

No. of Terminals: 40

A higher number of terminals provides flexibility for connectivity and enhances functionality, accommodating various design needs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enhances thermal performance, making it suitable for industrial applications where temperature stability is crucial.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C provides robustness for industrial environments, ensuring reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The capability to function at extremely low temperatures (-40 °C) makes this converter suitable for outdoor and harsh environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

The quad terminal positioning offers efficient routing and connectivity options, simplifying PCB layout design.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature standards, this product is reliable in demanding applications ranging from automotive to industrial automation.

Maximum Analog Input Voltage: 2 V

With a maximum analog input voltage of 2 V, this converter is suitable for low-voltage applications, enhancing safety and performance.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder contamination and enhances design flexibility in compact applications.

Converter Type: A/D CONVERTER

As an A/D converter, this device is essential for digitizing analog signals, making it critical in numerous electronic systems.

Nominal Supply Voltage: 3 V

Operating with a nominal supply voltage of 3 V helps in maintaining low power consumption and compatibility with other low-voltage devices.

Output Bit Code: OFFSET BINARY

Using an offset binary output format allows for simpler data processing, reducing complexity in interfacing with digital components.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch provides compatibility with modern PCB designs, allowing for high-density layouts without compromising performance.

Technical Specifications

Analog-to-Digital Converters ADC1010S125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.039 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1010S125HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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