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ADC0808S250HW/C1:5

NXP Semiconductors

ADC0808S250HW/C1:5 by NXP Semiconductors

NXP Semiconductors' ADC0808S250HW/C1:5 is an 8-bit ADC with a 250 MHz sample rate, ideal for industrial applications. It operates b/w -40 to 85°C, featuring a 3.3V supply voltage and GULL WING terminals. The converter supports BINARY output format and has a compact square package design for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 9,659 parts In-Stock

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VNN

France . 3,252 parts In-Stock

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Digiode

USA . 2,650 parts In-Stock

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Anansix

USA . 2,557 parts In-Stock

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Nova Conductors

Japan . 95 parts In-Stock

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One Stop Electronics

USA . 1,040 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 261 parts In-Stock

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Corohmni

South Africa . 165 parts In-Stock

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Aztec Data Supply Inc.

USA . 297 parts In-Stock

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$26.950

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Ampacity Inc.

Singapore . 1,156 parts In-Stock

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$31.000

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S.R.D Solutions

India . 12,000 parts In-Stock

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UNI Independent Distributors

Spain . 7,812 parts In-Stock

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Microchip USA

USA . 3,381 parts In-Stock

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Corphita

USA . 2,366 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,914 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

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Overview

Discover the cutting-edge ADC0808S250HW/C1:5 by NXP Semiconductors, a top-tier Analog-to-Digital Converter that guarantees unparalleled quality and reliability. With a focus on innovation and precision engineering, NXP Semiconductors delivers a product designed to exceed expectations in various applications. Offering superior performance and seamless integration, this converter provides exceptional value and benefits to customers looking for high-speed data conversion with utmost accuracy. Elevate your projects with the ADC0808S250HW/C1:5 and experience the difference that only a trusted industry leader can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for long-lasting use.

Surface Mount: YES

Allows for easy installation on circuit boards.

No. of Bits: 8

Provides high resolution for accurate conversion of analog signals.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperature environments.

Sample Rate: 250 MHz

High sampling rate for capturing fast-changing analog signals.

Nominal Supply Voltage: 3.3 V

Compatible with common supply voltages in industrial settings.

Technical Specifications

Analog-to-Digital Converters ADC0808S250HW/C1:5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, 8 Bits

Sample Rate:

250 MHz

Hold Mode:

Track

Electrical Specifications

Minimum Analog Input Voltage:

700 mV

Maximum Analog Input Voltage:

1 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

49

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G49

Qualified:

No

Trade Compliance

ADC0808S250HW/C1:5 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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