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ADC0801S040TS/C1

NXP Semiconductors

ADC0801S040TS/C1 by NXP Semiconductors

ADC0801S040TS/C1 from NXP is an 8-bit A/D converter ideal for compact applications. It features a max linearity error of 0.29% and operates at a nominal voltage of 3.3V, with a temperature range of 0 °C to 70 °C. Its small outline package ensures efficient surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,729 parts In-Stock

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3,729

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Vyrian

USA . 3,182 parts In-Stock

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3,182

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Anansix

USA . 224 parts In-Stock

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224

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Distributors (Availability)

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One Stop Electronics

USA . 874 parts In-Stock

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$32.000

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Native Components

USA . 406 parts In-Stock

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$39.473

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$37.894

406

$39.473

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$37.894

Northwest PG Solutions

USA . 1,640 parts In-Stock

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$43.421

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$43.421

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UNI Independent Distributors

Spain . 3,419 parts In-Stock

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Corphita

USA . 606 parts In-Stock

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Overview

Transform your data acquisition with the ADC0801S040TS/C1 from NXP Semiconductors, a trusted leader in innovative solutions. This high-performance analog-to-digital converter offers exceptional accuracy and reliability for a variety of applications, from industrial controls to consumer electronics. With its compact design and robust temperature range, you can count on seamless integration and long-lasting performance, enhancing your projects while reducing time to market. Elevate your technology with NXP’s commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, ensuring long-term reliability in various applications.

Surface Mount: YES

Surface mount technology allows for a smaller PCB footprint, making this converter ideal for compact designs.

Package Shape: RECTANGULAR

A rectangular package shape offers efficient space utilization and is easy to integrate into various circuit layouts.

No. of Bits: 8

An 8-bit resolution offers good performance for many applications, balancing complexity and cost.

Maximum Linearity Error (EL): 0.29%

With a low maximum linearity error, this ADC ensures high accuracy in signal conversion, making it suitable for precision applications.

Power Supplies (V): 3.3

Operating on a standard 3.3V supply enhances compatibility with most modern digital systems, ensuring easy integration.

No. of Terminals: 20

Having 20 terminals provides sufficient connectivity for a variety of applications while keeping manageable design complexity.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline, shrink pitch design minimizes space requirements on the PCB, which is advantageous for space-constrained applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C indicates reliability in moderate thermal environments, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C allows usage in a wider range of environments, enhancing the versatility of the product.

Terminal Position: DUAL

Dual terminal positioning can aid in reducing circuit trace lengths, contributing to better signal integrity.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures the device performs adequately for general purpose applications without extreme conditions.

Terminal Form: GULL WING

Gull wing terminal form enhances solderability and provides stable mechanical support, ensuring robust connections.

Converter Type: A/D CONVERTER

As an analog-to-digital converter, this product is essential for digitizing analog signals, making it suitable for various signal processing applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a widely adopted standard, allowing easy integration within existing projects.

Output Bit Code: BINARY

Binary output is compatible with digital systems, facilitating easy interfacing with microcontrollers and digital processors.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for close placement of components, benefiting high-density PCB layouts.

Technical Specifications

Analog-to-Digital Converters ADC0801S040TS/C1 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Maximum Linearity Error (EL):

0.29 %

Electrical Specifications

Power Supplies:

3.3 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

Trade Compliance

ADC0801S040TS/C1 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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