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935289318518

NXP Semiconductors

935289318518 by NXP Semiconductors

FIXED POSITIVE MULTIPLE OUTPUT STANDARD REGULATOR; No. of Terminals: 20; Package Code: HSOP; Terminal Form: GULL WING; Maximum Voltage Tolerance: 5.9 %; No. of Functions: 1;

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,961 parts In-Stock

1+ parts

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3,961

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Anansix

USA . 1,766 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,766

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Vyrian

USA . 607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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607

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,139 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,139

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Technical Specifications

Fixed Regulators - Positive Multiple Output Standard 935289318518 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output Standard devices from NXP Semiconductors

Specs

Maximum Input Voltage:

18 V

Minimum Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G20

Length:

15.9 mm

No. of Functions:

1

No. of Outputs:

4

No. of Terminals:

20

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Voltage-1:

9 V

Minimum Output Voltage-1:

8 V

Nominal Output Voltage-1:

8.5 V

Maximum Output Voltage-2:

5.25 V

Minimum Output Voltage-2:

4.75 V

Nominal Output Voltage-2:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

Width:

11 mm

Trade Compliance

935289318518 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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