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74LV139DB,118

NXP Semiconductors

74LV139DB,118 by NXP Semiconductors

OTHER DECODER/DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$0.356

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,645 parts In-Stock

1+ parts

-

100+ parts

$0.335

1k+ parts

$0.278

10k+ parts

$0.248

1,645

-

$0.335

$0.278

$0.248

Verical

USA . 1,615 parts In-Stock

1+ parts

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$0.377

10k+ parts

$0.310

1,615

-

-

$0.377

$0.310

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,119 parts In-Stock

1+ parts

$0.134

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1,119

$0.134

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Vyrian

USA . 4,933 parts In-Stock

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4,933

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ACDS - Activité Composants Distribution Service

France . 1,895 parts In-Stock

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1,895

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Anansix

USA . 276 parts In-Stock

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276

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Distributors (Availability)

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Corphita

USA . 1,823 parts In-Stock

1+ parts

$0.127

100+ parts

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1,823

$0.127

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AZTECH Wire

Italy . 474 parts In-Stock

1+ parts

$20.840

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474

$20.840

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Microchip USA

USA . 4,585 parts In-Stock

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4,585

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Perfect Parts

USA . 3,735 parts In-Stock

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3,735

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UNI Independent Distributors

Spain . 3,356 parts In-Stock

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Northwest PG Solutions

USA . 1,153 parts In-Stock

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Native Components

USA . 100 parts In-Stock

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100

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Technical Specifications

Decoder & Drivers 74LV139DB,118 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

LV/LV-A/LVX/H

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

39 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74LV139DB,118 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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