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74HCT299PW,112

NXP Semiconductors

74HCT299PW,112 by NXP Semiconductors

PARALLEL IN PARALLEL OUT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$0.997

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 337 parts In-Stock

1+ parts

-

100+ parts

$0.979

1k+ parts

$0.812

10k+ parts

$0.724

337

-

$0.979

$0.812

$0.724

Verical

USA . 337 parts In-Stock

1+ parts

-

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-

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$1.015

10k+ parts

$0.905

337

-

-

$1.015

$0.905

Distributors (In-Stock)

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Digiode

USA . 3,812 parts In-Stock

1+ parts

$0.391

100+ parts

-

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3,812

$0.391

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Vyrian

USA . 3,808 parts In-Stock

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Anansix

USA . 1,727 parts In-Stock

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1,727

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Distributors (Availability)

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Ampacity Inc.

Singapore . 337 parts In-Stock

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$0.350

100+ parts

-

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337

$0.350

-

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Corphita

USA . 1,382 parts In-Stock

1+ parts

$0.371

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1,382

$0.371

-

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AZTECH Wire

Italy . 717 parts In-Stock

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$9.530

100+ parts

-

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717

$9.530

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$16.240

100+ parts

$16.078

1k+ parts

$15.428

10k+ parts

-

100

$16.240

$16.078

$15.428

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Microchip USA

USA . 448 parts In-Stock

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$16.798

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448

$16.798

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UNI Independent Distributors

Spain . 4,681 parts In-Stock

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Native Components

USA . 623 parts In-Stock

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623

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Northwest PG Solutions

USA . 478 parts In-Stock

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478

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Technical Specifications

Digital Shift Registers 74HCT299PW,112 attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Additional Features:

HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

56 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

17 MHz

Trade Compliance

74HCT299PW,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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