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74HC93DB,118

NXP Semiconductors

74HC93DB,118 by NXP Semiconductors

BINARY COUNTER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,316 parts In-Stock

1+ parts

-

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1k+ parts

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6,316

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Anansix

USA . 1,563 parts In-Stock

1+ parts

-

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1k+ parts

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1,563

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Digiode

USA . 1,540 parts In-Stock

1+ parts

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1,540

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 683 parts In-Stock

1+ parts

$2.244

100+ parts

-

1k+ parts

$2.154

10k+ parts

$2.154

683

$2.244

-

$2.154

$2.154

Advanced Electronics

New Zealand . 4,445 parts In-Stock

1+ parts

$16.723

100+ parts

$16.555

1k+ parts

$15.887

10k+ parts

-

4,445

$16.723

$16.555

$15.887

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AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$20.890

100+ parts

-

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216

$20.890

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Ampacity Inc.

Singapore . 1,244 parts In-Stock

1+ parts

$22.000

100+ parts

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1,244

$22.000

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One Stop Electronics

USA . 1,124 parts In-Stock

1+ parts

$50.000

100+ parts

-

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1,124

$50.000

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Component Stockers USA

USA . 369 parts In-Stock

1+ parts

$99.990

100+ parts

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369

$99.990

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Native Components

USA . 522 parts In-Stock

1+ parts

$277.313

100+ parts

$271.767

1k+ parts

$268.994

10k+ parts

$266.220

522

$277.313

$271.767

$268.994

$266.220

Northwest PG Solutions

USA . 1,098 parts In-Stock

1+ parts

$305.044

100+ parts

-

1k+ parts

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10k+ parts

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1,098

$305.044

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QUARKTWIN TECHNOLOGY LTD

USA . 27,547 parts In-Stock

1+ parts

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100+ parts

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27,547

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UNI Independent Distributors

Spain . 5,750 parts In-Stock

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5,750

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Microchip USA

USA . 5,321 parts In-Stock

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5,321

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Corphita

USA . 1,094 parts In-Stock

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1,094

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Technical Specifications

Digital Counters 74HC93DB,118 attributes and parameters. Explore more Digital Counters devices from NXP Semiconductors

Specs

Additional Features:

DIVIDE BY 2 AND DIVIDE BY 8 FUNCTIONS

Count Direction:

UP

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Load or Preset Input:

YES

Logic IC Type:

Operation Mode:

ASYNCHRONOUS

Moisture Sensitivity Level (MSL):

1

No. of Bits:

3

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Propagation Delay (tpd):

71 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

5.3 mm

Minimum fmax:

20 MHz

Trade Compliance

74HC93DB,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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