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74HC590N,112

NXP Semiconductors

74HC590N,112 by NXP Semiconductors

BINARY COUNTER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$0.902

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 62 parts In-Stock

1+ parts

-

100+ parts

$0.902

1k+ parts

$0.749

10k+ parts

$0.667

62

-

$0.902

$0.749

$0.667

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,937 parts In-Stock

1+ parts

$0.360

100+ parts

-

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3,937

$0.360

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Vyrian

USA . 13,017 parts In-Stock

1+ parts

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13,017

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Anansix

USA . 1,538 parts In-Stock

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1,538

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Lakeland Logistics Inc

USA . 175 parts In-Stock

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175

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Bristol Electronics

USA . 175 parts In-Stock

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175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,480 parts In-Stock

1+ parts

$0.341

100+ parts

-

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1,480

$0.341

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Component Stockers USA

USA . 77 parts In-Stock

1+ parts

$0.390

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77

$0.390

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Microchip USA

USA . 1,195 parts In-Stock

1+ parts

$0.637

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1,195

$0.637

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AZTECH Wire

Italy . 641 parts In-Stock

1+ parts

$10.740

100+ parts

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641

$10.740

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UNI Independent Distributors

Spain . 3,324 parts In-Stock

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3,324

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Northwest PG Solutions

USA . 695 parts In-Stock

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695

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Native Components

USA . 485 parts In-Stock

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485

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Technical Specifications

Digital Counters 74HC590N,112 attributes and parameters. Explore more Digital Counters devices from NXP Semiconductors

Specs

Count Direction:

UP

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

Length:

19 mm

Load Capacitance (CL):

50 pF

Load or Preset Input:

NO

Logic IC Type:

Maximum Frequency At Nominal Supply:

22000000 Hz

Maximum I (ol):

6 Amp

Operation Mode:

ASYNCHRONOUS

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Propagation Delay (tpd):

230 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Counters

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

26 MHz

Trade Compliance

74HC590N,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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