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74HC366N,652

NXP Semiconductors

74HC366N,652 by NXP Semiconductors

NXP Semiconductors' 74HC366N,652 is a CMOS bus driver with 6 bits and 3-STATE output. It operates at supply voltages from 2V to 6V, with a propagation delay of 30ns at nominal voltage. This through-hole package is ideal for automotive applications requiring inverted output polarity and low enable control.

Median Price

$1.131

Lifecycle Status

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5

In-Stock Inventory

1k+

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Rochester

USA . 1,055 parts In-Stock

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-

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$1.110

1k+ parts

$0.921

10k+ parts

$0.821

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$1.110

$0.921

$0.821

Verical

USA . 1,055 parts In-Stock

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$1.152

10k+ parts

$1.027

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$1.152

$1.027

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Digiode

USA . 4,209 parts In-Stock

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$0.443

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Vyrian

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Anansix

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Corphita

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$0.419

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Andel Nordic

Denmark . 12 parts In-Stock

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$5.662

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$5.435

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$5.435

12

$5.662

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$5.435

$5.435

AZTECH Wire

Italy . 855 parts In-Stock

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$12.480

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855

$12.480

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Microchip USA

USA . 129 parts In-Stock

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$14.610

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$14.610

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$14.610

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$14.610

129

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$14.610

$14.610

$14.610

QUARKTWIN TECHNOLOGY LTD

USA . 12,034 parts In-Stock

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UNI Independent Distributors

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Continental Prestige Electronics

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$0.560

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Overview

Unlock seamless data transmission with the NXP Semiconductors 74HC366N,652 Bus Driver & Transceivers. Built with precision and reliability, this product ensures efficient communication across various systems. Ideal for automotive applications, this CMOS technology device offers a wide range of benefits such as fast propagation delay, low power consumption, and high durability. Upgrade your projects with the superior quality and performance of the 74HC366N,652 and experience unmatched value in every connection.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for automotive applications

Propagation Delay At Nominal Supply: 30 ns

Low propagation delay for efficient data transfer

Package Shape: RECTANGULAR

Standard shape for easy integration into circuit designs

No. of Bits: 6

Ideal for handling 6-bit data transmissions

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply

Load Capacitance (CL): 50 pF

Suitable for driving bus lines with capacitance up to 50 pF

Power Supplies (V): 2/6

Supports power supplies ranging from 2V to 6V

Maximum I (ol): 6 Amp

High output current capability for driving bus lines

Propagation Delay (tpd): 150 ns

Consistent delay in signal propagation for reliable data transmission

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments without issue

Output Characteristics: 3-STATE

Ability to drive bus lines with three output states for flexibility

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without malfunctioning

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for reliable connections

No. of Ports: 2

Supports connection to two different bus lines or devices

Maximum Seated Height: 4.7 mm

Low-profile design for compact circuit layouts

Width: 7.62 mm

Compact width for efficient use of space on a PCB

Output Polarity: INVERTED

Inverted polarity output for compatibility with specific systems

Minimum Supply Voltage (Vsup): 2 V

Can operate at low supply voltage for energy-efficient applications

Length: 21.6 mm

Optimal length for accommodating all terminals and connections

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges

Technology: CMOS

CMOS technology for low power consumption and high noise immunity

Terminal Form: THROUGH-HOLE

Through-hole terminals for secure PCB mounting

Packing Method: BULK

Bulk packaging option for cost-effective procurement

Terminal Pitch: 2.54 mm

Standard terminal pitch for universal compatibility

Control Type: ENABLE LOW

Controlled by setting enable signal to low for ease of use

Maximum Supply Voltage (Vsup): 6 V

Can handle high supply voltages for versatility

Technical Specifications

Bus Driver & Transceivers 74HC366N,652 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

21.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

BULK

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HC366N,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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